CORDIS Archive

Technology for Components and Subsystems

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Technologies for Components and Subsystems concerns the development and broad exploitation of a wide range of microelectronics solutions for electronic systems. Work encompasses equipment, materials and processes used in manufacturing semiconductors, through to electronic design tools, packaging and interconnect solutions. The area includes work on peripheral subsystems such as storage and displays, and work on microsystems.

Optimising Semiconductor Fabrication - ACCESS-CVD

A Complete Waste Gas Disposal System - ADAPT

VHDL Simulator Redefines Performance Levels - AIDA

Leading Edge Wafer Stepper Helps Semiconductor Manufacturers' Competitiveness - ASPRO

High Performance, High Capacity Multi-IC Packages - CHIPPAC

New Tool Simplifies Complex PCB Designs - CONSOLE

Thermal Modelling of Electronic Components - DELPHI

Flat Panel Displays: Europe's Future Becomes Clearer - ECAM 1

High Speed Power Amplifiers for Mobile Communications - EGIP

EDA Tools Verify Hardware Designs - FORMAT

Stimulating Microelectronics in Spain - GAME 2

Opening the Way for High-Speed Wireless Networking - HIPERION

Optical Interconnects for Hierarchical Computer Systems - HOLICS

Home Automation with the European Home System (EHS) - HS COMPONENTS

Inexpensive Multichip Modules Housed in Standard IC Packages - LOCOP

Super Floppy: a High Capacity Storage Medium - MAGDRIVE

Economic Modelling Helps Assess Building Management Systems - MOMENTUM

Simulation Tools Model EMI/EMC Behaviour - POWERCAD

Process Simulation Reduces Costs and Development Time for ICs - PROMPT

Real-time Emulation and Rapid Prototyping of DSP Systems - RETIDES

Breaking the Bottleneck in Video Processor Design - SPRITE-Phideo

Unique Hierarchical ULSI Post-Processor - VIP

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