Analysis of electrical and thermal features of semiconductor devices and assistance of their design
A package covering 4 programs has been developed. The programs of 2-dimensional simulation of electrical and electothermal phenomena inside semiconductor chips are based on numerical solution of the differential equations describing carrier and heat transport. They take into account the influence of temperature, doping and carrier density on recombination, mobility and intrinsic concentration as well as usually omitted phenomena like thermoelectric effects, resistivity of electrical contacts and the influence of heat flow through the package on the temperature inside the semiconductor chip. The program of 3-dimensional investigation of heat flow in the whole package applies the Rth, Cth idea with an original algorithm of an Rth, Cth net creation for complicated package structures. It can perform fast simulation even on a personal computer (PC).
The presented programs can be applied to investigate, optimize and design semiconductor devices. Together with other supplementing programs, they have already been used to investigate some phenomena inside semiconductor structures of power semiconductor devices as well as to design or optimize several power devices.
The programs make possible fast modelling of heat transfer through the whole package of a semiconductor device from the semiconductor chip, where it is dissipated, towards surroundings as well as simulations of electrical and electrothermal phenomena inside the semiconductor chip of the device under consideration. The programs can perform both steady state and transient analysis and can be used as an efficient computer aided design (CAD) tool assisting the design process of discrete semiconductor devices.
Manufacturing control systems; Manufacturing technologies; Electronic, desktop publishing
Stage of Development:
Intermediate design, research phase
Partnership/other contractual agreement(s)
Further research or development support,Financial support,Information exchange/Training
Sources of Support:
Contact Name: MIZIELINSKI, Marcin (Mr)
Department: IRC Poland East
Contact Organisation: Hi-Tech Co Ltd
Address: ul Akademicka 3
Telephone Number: +48-22-8254278
Fax Number: +48-22-8251248
Last updated: 2013-03-01