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Nanoelectronics Research on European level


picture-134.jpgNanoelectronics Research at European level

Project Classification

 

 

DESIGN

 

 

ATEMOX - Advanced TEchnology MOdelling for eXtra-functionality devices
The project will develop the full set of missing models and implement and include them into the Sentaurus TCAD platform of Synopsys so that they are of immediate value to the European semiconductor industry.
Total Budget: 4.3 M€
EC Contribution: 3.0 M€
 
DIAMOND - Diagnosis, Error Modelling and Correction for Reliable Systems Design
The aim of DIAMOND is improving the productivity and reliability of semiconductor and electronic system design in Europe by providing a systematic methodology and an integrated environment for the diagnosis and correction of errors.
Total Budget: 3.9 M€
EC Contribution: 2.9 M€
 
DRAGON - Design methods for Radio Architectures GOing Nanoscalelogo
The driving idea behind DRAGON is to research and use new design methodologies and architectural innovation based on reconfigurability and state-of-the-art digital CMOS technology to break the barriers imposed by the lacking scaling properties of analog components.
Total Budget: 5.1 M€
EC Contribution: 3.5 M€
 
ICESTARS - Integrated Circuit/EM Sumulation and design Technologies for Advanced Radio Systems-on-chip
The ICESTARS project will deliver the methodologies and prototype tools to make this possible, by combining the research results of several domains to achieve a clear view on the dependencies between different parts of the complete RF design.
Total Budget: 4.1 M€
EC Contribution: 2.8 M€
 
MOCHA - MOdeling and CHAracterization for SiP Signal and Power Integrity Analysis
The aim is to develop reliable modelling and simulation solutions for SiP design and verification. The modelling activity will be related to measurement analysis for validating the simulation results and making available characterization measurement platforms.
Total Budget: 3.2 M€
EC Contribution: 1.8 M€
 
NANOC - Nanoscale Silicon-Aware Network-on-Chip Design PlatformLogo, Video
The NaNoC design platform provides design methods and prototype tools to cope with both challenges and to make NoCs a mainstream interconnect backbone for effective system integration.
Total Budget: 4.1 M€
EC Contribution: 2.9 M€
 
REALITY - Reliable and Variability tolerant System-on-a-chip Design in More-Moore Technologiesrealitylogo.jpg
The objective of this project is to develop design techniques and methods for real-time guaranteed, energy-efficient, robust and self-adaptive SoCs.
Total Budget: 4.4 M€
EC Contribution: 2.89 M€
 
SIDAM - Investigation of Si wafer damage in manufacturing processessidamlogo.jpg
The project will comprise quantification of the XRDI images, modelling of the stresses introduced by the controlled defects, modelling the influence of thermal gradients in RTA upon the defects, and experimental confirmation of the conclusions.
Total Budget: 2.6 M€
EC Contribution: 2.0 M€
 
 
 
SUCCESS - Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors
SUCCESS targets to develop a technology platform and best-practice design methods to enable the breakthrough of silicon mm-Wave SoCs for high-volume applications.
Total Budget: 4.8 M€
EC Contribution: 2.98 M€
 
SYNAPTIC - SYNthesis using Advanced Process Technology Integrated in regular Cells, IPs, architectures, and design platforms synapticlogo.jpg
Synaptic project targets the optimisation of manufacturability and the reduction of systematic variations in nanometer technologies through exploitation of regularity at the architectural, structural, and geometrical levels.
Total Budget: 5.4 M€
EC Contribution: 3.5M€
THERMINATOR-Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Futureterminator.jpg
The THERMINATOR projects will address the following major challenges: 1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest. 3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.
Total Budget: 11.02 M€
EC Contribution: 6.4 M€