Nanoelectronics Research at European level
Project Classification
MANUFACTURING
COPPER - Copper Interconnects for Advanced Performance and Reliability
The project developed a radically new approach manufacturing a new generation of copper interconnects overcoming the roadblocks for further advances in CMOS miniaturisation for such as: a) shifting electrical characteristics, e.g. reducing the resistive capacitive delay; b) changes in thermal and mechanical behaviour; c) interconnect reliability.
Total Budget: 4.7 M€
EC Contribution: 3.1 M€
Fact sheet
MAGIC - MAsk less lithoGraphy for IC manufacturing
This project focuses on strengthening the development of ML2 technology in Europe through two linked poles:
1. The first one will be focused on MAPPER and IMS-NANO tool developments with the objective to deliver a first ML2 Alpha Tool platform compatible for 32nm half pitch technology before 2010.
2. To demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platforms developed by the tool partners.
Total Budget: 16.9 M€
EC Contribution: 11.7 M€
MAGIC - MAsk less lithoGraphy for IC manufacturing
This project focuses on strengthening the development of ML2 technology in Europe through two linked poles:
1. The first one will be focused on MAPPER and IMS-NANO tool developments with the objective to deliver a first ML2 Alpha Tool platform compatible for 32nm half pitch technology before 2010.
2. To demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platforms developed by the tool partners.
Total Budget: 16.9 M€
EC Contribution: 11.7 M€
MD3- Material Development for Double exposure and Double patterning
MD3 aims to suppress the additional etching or exposure steps by developing new strategies for double pattering or double exposure. Three novel approaches will be evaluated: dual layer approach, pattern doubling strategy and double exposure technique.
Total Budget: 4.7 M€
EC Contribution: 3.1 M€
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. SEAL aims to strengthen the European equipment manufacturing industry in a sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes, equipment suppliers, SMEs etc.
Total Budget: 14.2 M€
EC Contribution: 9 M€
Total Budget: 14.2 M€
EC Contribution: 9 M€