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Communications and components
Communications, components
| Project N° |
Acronym |
Title |
Keywords |
| IST-2001-55034 |
SAFE COMM |
FLEXIBLE PRINTING OF SEEDING LAYER FOR 3D TWISTED LOOP CIRCUIT ON CERAMIC PUCKS TO ENABLE PRODUCTION OF HIGH EFFICIENCY ANTENNA FOR CELL PHONE LOCATION |
antenna, process technologies |
| IST-1999-10945 |
MELODICT |
Micromachined Electromechanical Devices for Integrated Wireless Communication Transceivers |
CMOS, wafer bonding, bulk- surface machining, RF MEMS, filters, switches, PA's, Varicaps, VCO's |
| IST-2000-52036 |
DIGISLI |
Mix mode solid state inline analogue line interface for asymetric digital subscriber lines. |
Line interface |
| IST-1999-20108 |
TESMI |
Teflon based Stripline for Microwave systems |
microwave substrates |
| IST-2001-33286 |
WIDE-RF |
INNOVATIVE MEMS DEVICES FOR WIDEBAND RECONFIGURABLE RF MICROSYSTEMS |
CMOS, SOI, bilk membranes, micro-drop technology, |
| IST-2000-30162 |
MELODY |
Microwave Electronics with Tuneable Dielectric Layers |
ferroelectrics, tuneable dielectric permittivity |
| IST-2001-37658 |
ARHMS |
Advanced High power RF subsystems exploiting MEMS switches for wireless applications |
MEMS switches |
| IST-2000-28231 |
MEMS2TUNE |
Development of a metal-based MEMS technology for realising tunable/switchable RF modules for wireless applications |
RF MEMS |
| IST-1999-11411 |
MEDCOM |
Microwave electro-acoustic devices for mobile and land based communications |
SAW and BAW filters, sputtering, procesing |
| IST-2000-30006 |
BLUE WHALE |
Wafer level packaging for Handheld Applications in a LAN Environment System-on-Chip Packaging for Wireless Connectivity |
Wafer scale packaging, ball bonding, bluetooth | Communications
| Project N° |
Acronym |
Title |
Keywords |
| IST-1999-11114 |
ADEPT |
Advanced Design, Partitioning and Test in communication subsystems |
Analogue RF ASIC |
| IST-1999-20764 |
HISAMA |
High density Interconnection for Space, Avionics and entreprise Mobility Applications |
High Density Interconnection Printed Circuit Boards |
| IST-2001-37362 |
MARTINA |
Monolithic Above IC Resonator Technology for Integrated Novel Architecture in mobile and wireless communication |
IC FBAR Resonator, RF-MEMS |
| IST-2001-52213 |
WEB CONSYS |
WEB-BASED, WIRELESS CONFERENCE INFO-SYSTEM |
Multichannel system, voice and data transmission |
| IST-2001-34327 |
ANITA |
Audio eNhancement In secured Telecommunication Applications |
signal processing, voice |
| IST-1999-20337 |
DIPSYLAN |
DISTRIBUTED PBX DEVELOPMENT SYSTEM WITH LAN INTERCONNECTION |
WAN, LAN interfacing |
| IST-2000-31065 |
ARTEMIS |
Advanced RF Frontend Technology using Micromachined Si/SiGe Structures |
SiGe |
| IST-2001-34406 |
VIGOR |
Vertical Integration of Optoelectronic and Radio (sub)systems |
system-in-a-package, 3D technology |
| IST-2001-33207 |
ECIAD |
Experimental Controller for Integrated Access Devices |
ASIC design, wide/local area network |
| IST-2001-35246 |
BLUEPAC |
Advanced integrated antenna package for Bluetooth wireless communication |
Bluetooth, antenna integration, system in a package |
| IST-2000-30109 |
GALACTIC |
Innovative Gallium Arsenide MMICs and Advanced LTCC Packaging Technologies for Multicomponent Ka-band Subsystems |
LTCC, Power Amplifier, multifunctional MMIC |
| IST-2000-30060 |
SMACKS |
Surface Mount Assembly for Communications Ka band Systems |
Power GaAs, filter integration, SMT MMIC |
| IST-2000-30128 |
LIPS |
Low Cost Interconnect, Packaging and Sub-system Integration Technologies for Millimetre-Wave Applications |
Very high frequency interconnection |
| IST-1999-20260 |
MULTI-MODULES |
TRIAL FOR MULTI MODE MODULES FOR MOBILE TERMINALS |
passive, VCO, filter integration |
Last updated: 25 | 11 | 2002 |
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