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MIRAGE

Project reference: 318228
Funded under: FP7-ICT

Multi-coRe, multi-level, WDM-enAbled embedded optical enGine for Terabit board-to-board and rack-to-rack parallel optics [Print to PDF] [Print to RTF]

From 2012-10-01 to 2015-09-30

Project details

Total cost:

EUR 4 326 908

EU contribution:

EUR 2 999 964

Coordinated in:

Greece

Call for proposal:

FP7-ICT-2011-8

Funding scheme:

CP - Collaborative project (generic)

MIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D "optical engine".

Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibres (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8” Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implemented for 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout.

Objective

Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibrer (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8" Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implementedfor 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout.

Related information

Documents and Publications

Open Access

Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Greece
Iroon Polytechniou 9
Zografou, Greece
Administrative contact: Hercules Avramopoulos
Tel.: +302107722076
Fax: +302107722077
E-mail

Participants

AMS AG
Austria
TOBELBADERSTRASSE
UNTERPREMSTAETTEN, Austria
Administrative contact: Yasmine Pree
Tel.: +4331365005474
Fax: +4331365005756
E-mail
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium
Kapeldreef
LEUVEN, Belgium
Administrative contact: Christine Van Houtven
Tel.: +3216281613
E-mail
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germany
OTTO BLUMENTHAL STRASSE
AACHEN, Germany
Administrative contact: Michael Waldow
Tel.: +49 241 8867 215
Fax: +49 241 8867 560
E-mail
TECHNISCHE UNIVERSITAET MUENCHEN
Germany
Arcisstrasse
MUENCHEN, Germany
Administrative contact: Katrin Hörmann
Tel.: +49 89 28922629
Fax: +49 89 22620
E-mail
ARISTOTELIO PANEPISTIMIO THESSALONIKIS
Greece
Administration Building, University Campus
THESSALONIKI, Greece
Administrative contact: Nikos Pleros
Tel.: +302310998776
Fax: +302310200392
E-mail
MELLANOX TECHNOLOGIES LTD - MLNX
Israel
YOKNEAM ILIT INDUSTRIAL ZONE - HERMON BUILDING
YOKNEAM, Israel
Administrative contact: Assaf Segal
Tel.: +972 74 723 7051
Fax: +972 49 593 245
E-mail
OPTOSCRIBE LIMITED
United Kingdom
ALBA INNOVATION CENTRE
LIVINGSTON, United Kingdom
Administrative contact: Nicholas Psaila
Tel.: +441506592100
Fax: +441506592351
E-mail
Record Number: 105622 / Last updated on: 2014-09-03