Descripción del proyecto Core and disruptive photonic technologiesMIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D "optical engine".Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibres (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8” Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implemented for 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Mostrar el objetivo del proyecto Ocultar el objetivo del proyecto Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibrer (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8" Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implementedfor 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Ámbito científico engineering and technologymaterials engineeringfibersnatural sciencescomputer and information sciencesinternetnatural sciencesphysical sciencesopticsnatural scienceschemical sciencesinorganic chemistrymetalloids Programa(s) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Tema(s) ICT-2011.3.5 - Core and disruptive photonic technologies Convocatoria de propuestas FP7-ICT-2011-8 Consulte otros proyectos de esta convocatoria Régimen de financiación CP - Collaborative project (generic) Coordinador EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON Aportación de la UE € 447 398,00 Dirección PATISION 42 106 82 ATHINA Grecia Ver en el mapa Región Αττική Aττική Κεντρικός Τομέας Αθηνών Tipo de actividad Research Organisations Contacto administrativo Hercules Avramopoulos (Prof.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos Participantes (7) Ordenar alfabéticamente Ordenar por aportación de la UE Ampliar todo Contraer todo AMS-OSRAM AG Austria Aportación de la UE € 380 189,00 Dirección TOBELBADERSTRASSE 30 SCHLOSS PREMSTATTEN 8141 UNTERPREMSTATTEN Ver en el mapa Región Südösterreich Steiermark Graz Tipo de actividad Private for-profit entities (excluding Higher or Secondary Education Establishments) Contacto administrativo Yasmine Pree (Ms.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Bélgica Aportación de la UE € 639 322,00 Dirección KAPELDREEF 75 3001 Leuven Ver en el mapa Región Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Tipo de actividad Research Organisations Contacto administrativo Christine Van Houtven (Mrs.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH Alemania Aportación de la UE € 284 118,00 Dirección OTTO BLUMENTHAL STRASSE 52074 Aachen Ver en el mapa Región Nordrhein-Westfalen Köln Städteregion Aachen Tipo de actividad Other Contacto administrativo Anna Lena Giesecke (Dr.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos TECHNISCHE UNIVERSITAET MUENCHEN Alemania Aportación de la UE € 480 439,00 Dirección Arcisstrasse 21 80333 Muenchen Ver en el mapa Región Bayern Oberbayern München, Kreisfreie Stadt Tipo de actividad Higher or Secondary Education Establishments Contacto administrativo Katrin Hörmann (Ms.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos ARISTOTELIO PANEPISTIMIO THESSALONIKIS Grecia Aportación de la UE € 323 260,00 Dirección KEDEA BUILDING, TRITIS SEPTEMVRIOU, ARISTOTLE UNIVERSITY CAMPUS 546 36 THESSALONIKI Ver en el mapa Región Βόρεια Ελλάδα Κεντρική Μακεδονία Θεσσαλονίκη Tipo de actividad Higher or Secondary Education Establishments Contacto administrativo Nikos Pleros (Prof.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos MELLANOX TECHNOLOGIES LTD - MLNX Israel Aportación de la UE € 267 180,00 Dirección YOKNEAM ILIT INDUSTRIAL ZONE - HERMON BUILDING 20692 Yokneam Ver en el mapa Tipo de actividad Private for-profit entities (excluding Higher or Secondary Education Establishments) Contacto administrativo Assaf Segal (Mr.) Enlaces Contactar con la organización Opens in new window Sitio web Opens in new window Coste total Sin datos OPTOSCRIBE LIMITED Reino Unido Aportación de la UE € 178 058,00 Dirección UNIT 1 ROSEBANK PARK ROSEBANK ROAD EH54 7EJ Livingston Ver en el mapa Región Scotland Eastern Scotland West Lothian Tipo de actividad Private for-profit entities (excluding Higher or Secondary Education Establishments) Contacto administrativo Nicholas Psaila (Dr.) Enlaces Contactar con la organización Opens in new window Coste total Sin datos