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MIRAGE

Project reference: 318228
Funded under

Multi-coRe, multi-level, WDM-enAbled embedded optical enGine for Terabit board-to-board and rack-to-rack parallel optics

From 2012-10-01 to 2016-05-31, closed project

Project details

Total cost:

EUR 4 314 208

EU contribution:

EUR 2 999 964

Coordinated in:

Greece

Call for proposal:

FP7-ICT-2011-8See other projects for this call

Funding scheme:

CP - Collaborative project (generic)

MIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D "optical engine".

Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibres (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8” Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implemented for 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout.

Objective

Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibrer (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8" Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implementedfor 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout.

Related information

Documents and Publications

Open Access

Multimedia

Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Greece

EU contribution: EUR 447 398


Iroon Polytechniou 9
15773 Zografou
Greece
Administrative contact: Hercules Avramopoulos
Tel.: +302107722076
Fax: +302107722077
E-mail

Participants

AMS AG
Austria

EU contribution: EUR 380 189


TOBELBADERSTRASSE 30
8141 UNTERPREMSTAETTEN
Austria
Administrative contact: Yasmine Pree
Tel.: +4331365005474
Fax: +4331365005756
E-mail
INTERUNIVERSITAIR MICRO-ELECTRONICACENTRUM IMEC VZW
Belgium

EU contribution: EUR 639 322


KAPELDREEF 75
3001 LEUVEN
Belgium
Administrative contact: Christine Van Houtven
Tel.: +3216281613
E-mail
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germany

EU contribution: EUR 284 118


OTTO BLUMENTHAL STRASSE 25
52074 AACHEN
Germany
Administrative contact: Anna Lena Giesecke
Tel.: +49 241 8867 212
Fax: +49 241 8867 571
E-mail
TECHNISCHE UNIVERSITAET MUENCHEN
Germany

EU contribution: EUR 480 439


Arcisstrasse 21
80333 MUENCHEN
Germany
Administrative contact: Katrin Hörmann
Tel.: +49 89 28922629
Fax: +49 89 22620
E-mail
ARISTOTELIO PANEPISTIMIO THESSALONIKIS
Greece

EU contribution: EUR 323 260


UNIVERSITY CAMPUS ADMINISTRATION BUREAU
54124 THESSALONIKI
Greece
Administrative contact: Nikos Pleros
Tel.: +302310998776
Fax: +302310200392
E-mail
MELLANOX TECHNOLOGIES LTD - MLNX
Israel

EU contribution: EUR 267 180


YOKNEAM ILIT INDUSTRIAL ZONE - HERMON BUILDING
20692 YOKNEAM
Israel
Administrative contact: Assaf Segal
Tel.: +972 74 723 7051
Fax: +972 49 593 245
E-mail
OPTOSCRIBE LIMITED
United Kingdom

EU contribution: EUR 178 058


ALBA INNOVATION CENTRE SUITE 0/14
EH54 7GA LIVINGSTON
United Kingdom
Administrative contact: Nicholas Psaila
Tel.: +441506592100
Fax: +441506592351
E-mail
Record Number: 105622 / Last updated on: 2016-04-01