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Content archived on 2024-06-18

Enabling advanced functionalities of Diamond and other ultra-hard materials by Integrated Pulsed Laser Ablation Technologies

Objective

Diamond and other ultra-hard materials possess outstanding mechanical, wear and thermal properties that make them attractive to manufacture a wide range of high value-added products such as high-performance, smart tools. However, due to the extreme properties of this group of materials, efficient and precise generation of complex 3D freeform geometries and structures to meet the needs for a further development of high-performance tools is still a challenge. DIPLAT addresses the need for an efficient, precise and flexible processing technology for ultra-hard materials in tooling applications, in order to fully exploit the potential of these materials. By smartly utilizing the advantages of high brilliance short and ultra-short pulsed lasers, a tooling technology based on 3D Pulsed Laser Ablation (PLA) will be developed and demonstrated for various industrial applications. DIPLAT will introduce new technology platform for producing ultra-hard tools with enhanced functionality, outstanding machining performance and superior lift-time. In this regard, DIPLAT fosters the following four main scientific and technological objectives: (1) Design functional surfaces (with controlled micro geometries) on diamond and other ultra-hard materials to enable enhanced functionality for tooling applications; (2) Study and development of advanced 3D processing strategies for structuring/conditioning of ultra-hard tool surfaces and superabrasive grain layers by Pulsed Laser Ablation; (3) Develop and implement a novel multi-axis control concept and a model-based CAM software support module to enable optimized 3D pulsed laser processing; (4) Fabrication of various novel prototype tools made of ultra-hard materials and demonstration of their superior performance and functionality in challenging industrial applications. DIPLAT will lead to a technological breakthrough that will push European manufacturing industries to the cutting edge of high-performance machining and tooling technology.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

FP7-2012-NMP-ICT-FoF
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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

CP-TP - Collaborative Project targeted to a special group (such as SMEs)

Coordinator

EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH
EU contribution
€ 839 600,00
Address
Raemistrasse 101
8092 Zuerich
Switzerland

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Region
Schweiz/Suisse/Svizzera Zürich Zürich
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (7)

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