Objective
To overcome the difficulties in the contemporary thermal management of Si components and packages made of ceramics and organic laminates, in this project we propose novel and scaleable cooling technologies that utilize carbon nanotubes and their architectures integrated on various electrical components to achieve cooling efficiency of 100 W/m2 on large area Si chips, 10 W/cm2 on ceramics/polymer packages and 1 kW/cm2 on micro hot spots. Our efforts in the project are focused on generating specifically tailored nanostructured carbon based materials that are crucial for the successful development of new thermal management technologies in current and future electronics. The technologies we are developing will enable direct integration of carbon nanotube architectures in electrical components and make a feasible protocol for upscaling for industrial use. As carbon nanotubes will be directly grown (and in some cases post-mounted) on Si chips/wafers and ceramic/plastic packages the process will be made compatible with conventional Si fabrication and micromodule packaging technologies, i.e. the technology would provide a ready protocol for large scale production of such components. Because of the compatibility with current technologies, the nanotube based cooling devices and production technologies will be cost effective and easy to commercialize. Since thermal management is the most crucial issue in today’s high performance electrical devices (processors, power transistors) the market potential of our innovation is enormous exceeding several billion € total sales every year.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology mechanical engineering thermodynamic engineering
- natural sciences chemical sciences polymer sciences
- engineering and technology materials engineering ceramics
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-NMP-2008-SMALL-2
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
90014 Oulu
Finland
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.