Objectif We propose a step change in the way plasma etching processes are controlled, through understanding, measuring and controlling the key parameters determining the environment experienced by a processed substrate. We will use simulation, experiments and innovative plasma processing concepts to demonstrate robust PLASMA ETCHING OF NANO-SCALE FEATURES as well as CONTROLLED SURFACE NANO-ROUGHNESS and texture. We will use a multi-level nested approach for the understanding and optimisation of plasma processing for nanotechnology: The first level is the plasma tool and the gas phase plasma state, the second level is the surface and the features being etched, while the third level is the nano-texture and nano-roughness of the surfaces and features etched. A feedback loop will be developed to optimise simultaneously all levels of the nano-scale etching This will greatly improve the ability, especially of SMEs, to achieve reliable fabrication of nano-devices in small batch development, and in the scale-up to larger production quantities. Champ scientifique engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradio frequencyengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcontrol systemsengineering and technologynanotechnologynatural scienceschemical sciencesinorganic chemistrymetalloidsnatural sciencescomputer and information sciencessoftwaresoftware applicationssimulation software Programme(s) FP6-NMP - Nanotechnologies and nanosciences, knowledge-based multifunctional materials and new production processes and devices: thematic priority 3 under the 'Focusing and integrating community research' of the 'Integrating and strengthening the European Research Area' specific programme 2002-2006. Thème(s) NMP-2004-IST-NMP-3 - Materials, Equipment and Processes for Production of Nano-Photonic and Nano-Electronic Devices Appel à propositions FP6-2004-IST-NMP-2 Voir d’autres projets de cet appel Régime de financement STREP - Specific Targeted Research Project Coordinateur OXFORD INSTRUMENTS PLASMA TECHNOLOGY LTD Contribution de l’UE Aucune donnée Adresse Old Station Way, Eynsham WITNEY OXFORDSHIRE Royaume-Uni Voir sur la carte Coût total Aucune donnée Participants (5) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire TECHNISCHE UNIVERSITAET ILMENAU Allemagne Contribution de l’UE Aucune donnée Adresse Max-Planck-Ring 14 100565 ILMENAU Voir sur la carte Liens Site web Opens in new window Coût total Aucune donnée DUBLIN CITY UNIVERSITY Irlande Contribution de l’UE Aucune donnée Adresse Glasvenin DUBLIN Voir sur la carte Liens Site web Opens in new window Coût total Aucune donnée NATIONAL CENTER FOR SCIENTIFIC RESEARCH "DEMOKRITOS" Grèce Contribution de l’UE Aucune donnée Adresse Terma (End of Street) Patriarchou Gregoriou Str. P.O. Box 60228 AGHIA PARASKEVI Voir sur la carte Liens Site web Opens in new window Coût total Aucune donnée S3SOLUTIONS GMBH Allemagne Contribution de l’UE Aucune donnée Adresse Sollachweg 9 WESSLING Voir sur la carte Liens Site web Opens in new window Coût total Aucune donnée ISMA LTD Bulgarie Contribution de l’UE Aucune donnée Adresse Samokovsko Shosse 2 SOFIA Voir sur la carte Coût total Aucune donnée