Objective
With the fast development of applications based on smart and miniaturized sensors in aerospace, medical or automotive domains, requirements on electronic modules are more and more linked to size, stability, reliability and performances.
Capacitors are key components of electronic modules to deliver power with the right voltages to different functions from a single power source (such as a battery) or to protect them against voltage jumps.
IPDiA has developed for many years a technology of integrated capacitors (called PICS) which overcomes current technologies (e.g. tantalum capacities) and which can be a solution to build highly integrated and high performances electronic modules.
The goal of the PICS project is to go further and to bring a technological gap to get higher densities of capacitors and higher breakdown voltage. It will open the way to new markets by offering even more integration level and miniaturization (in order to increase the functionality combination and the complexity within a single package) and higher performances (in order to ensure long life operations and be able to place the sensors as close as possible to the “hottest” areas for efficient monitoring).
The innovation will be based on the use of a specific technology called atomic layer deposition, or ALD, that will enable to obtain an impressive quality of dielectric. Besides technical goals, the PICS project aims also to set-up a cost effective industrial solution.
Three SMEs, IPDiA, Sentech and Picosun, join forces with two research institutes, Fraunhofer and CEA, to response to these challenges. The first targeted markets are the high-end integrated capacitors for medical applications and the future DRAM market.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-SME-2013
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
14000 Caen
France
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.