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Integrated, Intelligent modular power electronic converter

Objective

Increasingly demanding requirements in the transportation industry for higher efficiency and reduced carbon footprint are leading to an ever increasing interest in electrically operated drives which offer significant benefits over their pneumatic or hydraulic counterparts. More electric aircraft technologies with fully electrical actuation and environmental conditioning systems are moving from topics of academic interest to commercial applications.
Despite the progress in power electronics and electrical drives, significant advances in power density and reliability are still required before electrical technologies are fully accepted in the aircraft industry. The thermal management of losses generated in the power converters, with the associated requirements for heavy cooling systems, is proving to be the stumbling block for further improvements in power density.
Ground-breaking advances in wide band-gap semiconductor materials are promising to deliver significant benefits to power conversion systems with unprecedented levels of power density thanks to considerably reduced losses and high temperature operation, making them ideal building blocks for aerospace power electronics.
Leveraging on some of EU best expertise in device manufacture and packaging, components integration, thermal management, converters design, reliability analysis, control and condition monitoring, as well as aircraft power systems, the proposal will demonstrate significant advances of the state of the art in power converters for harsh environments. Innovative 3D device packaging based on planar interconnect technologies with double-sided integrated cooling, will be demonstrated for wide band-gap wire-bond free power semiconductor devices. These technological breakthroughs, coupled with novel methodologies for active thermal management, lifetime testing, health management and prognosis will contribute to unprecedented levels of power density, efficiency and reliability in aerospace application

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

RIA - Research and Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-MG-2014-2015

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Coordinator

SIEMENS AKTIENGESELLSCHAFT
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 662 357,50
Address
WERNER-VON-SIEMENS-STR. 1
80333 Munchen
Germany

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Region
Bayern Oberbayern München, Kreisfreie Stadt
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 2 662 357,50

Participants (11)

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