TMGSiPProject ID: 658764
Financé au titre de:
THz Muti-Gb/s System in Package
Détails concernant le projet
Coût total:EUR 195 454,80
Contribution de l'UE:EUR 195 454,80
Coordonné à/au(x)/en:United Kingdom
Appel à propositions:H2020-MSCA-IF-2014See other projects for this call
Régime de financement:MSCA-IF-EF-ST - Standard EF
"The goal of "THz Muti-Gb/s System in Package", i.e., "TMGSiP" project is to develop a fully integrated 120GHz radio front-end for Multi-Gb/s radio links with state-of-the-art SiGe BiCMOS technology. This will be done with a completely new cross-cutting design methodology for silicon-MMIC, e.g. the development of wideband receiver and transmitter, including on-chip antenna and novel packaging concepts. This will enable a big improvement in the functionality (complexity of RF MMICs), performance (data rate), component size (fully-integrated compact MMIC with integrated antennas), low power, and cost over existing III/V communication systems.
The project’s ambition is to realize a THz SiP analog front-end with integrated antennas for a line of sight communication link with data rates up to 40Gbps centered around 120GHz and bandwidth of 20GHz with range up to a few meters. Due to the huge available bandwidth only simple low-order modulation schemes like QPSK will be considered."
Contribution de l'UE: EUR 195 454,80
TYNDALL AVENUE SENATE HOUSE
BS8 1TH BRISTOL