Objective
This R&I action will focus on optimally combining traditional roll-to-roll (R2R) compatible fabrication technologies such as printing with unique R2R sputtering, ALD and heterogeneous integration for flexible, thin, large-area electronics applications. It is seen that the different R2R fabrication methods all have their strengths and weaknesses such that using a cost-performance-optimized combination of them for a single production will enable new levels of applicability for TOLAE devices for mass markets. The goal of the ROLL-OUT project is to create a multi-purpose technology for, thin, large-area, high-performance, smart, and autonomous systems comprising of integrated circuits (based on metal-oxide thin-film transistors), sensors, and electronics. They will be utilized in advancing the packaging, automotive interiors and textile industries beyond their traditional scope. The key features are high-performance circuits and components. To fabricate high-performance circuits, the project intends to use novel, hybrid, moderate-temperature, roll-to-roll processes, namely sputtering, Atomic Layer Deposition (ALD) and screen-printing on thin, flexible, large-area substrates. This will enable enormous value addition to the products of European industries without adding any significant extra cost.
ROLL-OUT has 5 research organizations (RO) and 5 industrial partners (IND). The action has 6 work-packages (WPs) of which 3 are led by ROs and 3 by INDs. The technology development WPs are led by ROs and demonstration and exploitation WPs are led by INDs. The action intends to create 3 tangible industrial smart, autonomous system demonstrators that will be validated by the industrial partners in accordance with standard testing protocols.
The action seeks EU funding of 3.66M€ for a period of 36 months. 356,5 person-months will be dedicated to the work. The consortium consists of partners from 7 EU member states with complimentary expertise essential for the action.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technologyother engineering and technologiesfood technology
- engineering and technologymaterials engineeringtextiles
- engineering and technologymaterials engineeringcoating and films
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- engineering and technologynanotechnologynano-materials
You need to log in or register to use this function
We are sorry... an unexpected error occurred during execution.
You need to be authenticated. Your session might have expired.
Thank you for your feedback.
You will soon receive an email to confirm the submission. If you have selected to be notified about the reporting status, you will also be contacted when the reporting status will change.
Programme(s)
- H2020-EU.2.1.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT) Main Programme
- H2020-EU.2.1.1.1. - A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems
Call for proposal
(opens in new window) H2020-ICT-2014
See other projects for this callSub call
H2020-ICT-2014-1
Funding Scheme
RIA - Research and Innovation actionCoordinator
02150 Espoo
Finland