Hybrid Ultra Flexible Printed Circuits combining flexible and low-cost printed electronics with high performance traditional silicon components.

Projektinformationen

UFPC Technology

ID Finanzhilfevereinbarung: 683725

DOI 10.3030/683725

Abgeschlossenes Projekt

EK-Unterschriftsdatum 12 Juni 2015

Startdatum 1 Juli 2015

Enddatum 31 Oktober 2015

Finanziert unter

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies

Gesamtkosten € 71 429,00

EU-Beitrag € 50 000,00

Koordiniert durch

VIVA DEVELOPMENTS SL
Spain

Ziel

Printed electronics is a revolutionary, new way of manufacturing electronic components by using standard printing processes coming from the graphic arts, such as screen printing or inkjet, the difference being that it uses conducting inks. This new technique allows to print electronic components and circuits (e.g. connectors, resistors, sensors, transistors), on widely differing flexible substrates, like plastic, textiles or paper. The printed circuits and components are thin, lightweight, flexible, enabling single use/disposable devices, ubiquitous electronics and new applications, with high volume production at an economical price, compared to traditional silicon electronics.

VIVAINNOVA, a company specialised in the field of printed electronics, has developed an innovative hybrid technology, the Ultra Flexible Printed Circuit (UFPC) that combines printed electronics with traditional silicon components in an ultra low cost, ultra thin and ultra flexible electronic circuit solution. Through the new UFPC technology we will transform the electronics industry by exploiting the competitive advantages of both technologies, combining the ‘high-performance and intelligent silicon-electronics’ with the ‘cost-effective and flexible printed electronics’ and to fill the technological gap between fully-printed electronics and the expansive market of the intelligent objects. The UFPC technology will develop a new generation of electronic circuits giving to the products many properties previously unthinkable like ‘smart capabilities’ combined with ‘flexibility, thinness, light-weight and robustness’, at an ‘economical price’. It will allow to reduce the manufacturing cost of smart flexible electronic circuits by up to 50% compared with the current hybrid solutions.

Wissenschaftliches Gebiet

• engineering and technology › electrical engineering, electronic engineering, information engineering › electronic engineering › sensors › optical sensors
• engineering and technology › mechanical engineering › thermodynamic engineering
• engineering and technology › mechanical engineering › vehicle engineering › aerospace engineering › aircraft
• engineering and technology › materials engineering › textiles
• natural sciences › chemical sciences › inorganic chemistry › metalloids

Programm/Programme

• H2020-EU.2.1.2. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies Main Programme
• H2020-EU.2.3.1. - Mainstreaming SME support, especially through a dedicated instrument

Thema/Themen

• NMP-25-2015-1 - Accelerating the uptake of nanotechnologies, advanced materials or advanced manufacturing and processing technologies by SMEs

Aufforderung zur Vorschlagseinreichung

H2020-SMEInst-2014-2015

Andere Projekte für diesen Aufruf anzeigen

Unterauftrag

H2020-SMEINST-1-2015

Finanzierungsplan

SME-1 - SME instrument phase 1

Koordinator

VIVA DEVELOPMENTS SL

• Netto-EU-Beitrag: € 50 000,00
• Adresse: CL ALAMEDA CERVANTES 42 3 D ; 30800 LORCA ; Spanien
• KMU Die Organisation definierte sich zum Zeitpunkt der Unterzeichnung der Finanzhilfevereinbarung selbst als KMU (Kleine und mittlere Unternehmen). Ja:
  Region
  Sur › Región de Murcia › Murcia
• Region: Sur › Región de Murcia › Murcia
• Aktivitätstyp: Private for-profit entities (excluding Higher or Secondary Education Establishments)
• Gesamtkosten: € 71 429,00