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Platform for Heterogeneous Integration of NEMS on ICs

Objective

Within the ERC-M&M´s Starting Grant project (No.277879) we are exploring an innovative platform technology for wafer-level heterogeneous integration of integrated circuits (ICs) with micro/nano-electromechanical systems (MEMS/NEMS). This type of heterogeneous 3D integration technology is part of the More-than-Moore paradigm depicted in the International Technology Roadmap for Semiconductors (ITRS) and allows the combination of standard CMOS-based integrated circuits and high-performance MEMS devices to form complex and highly integrated systems that are not possible to manufacture with other micro-manufacturing approaches. First heterogeneous integration platforms for IC-integrated MEMS products have already been commercialized with great success by InvenSense (USA) and by mCube (USA) in collaboration with TSMC (Taiwan), the world’s largest CMOS foundry. However, the established heterogeneous integration technologies have limitations with respect to the type of MEMS devices that can be realized and the extent to which the MEMS-ICs system component can be miniaturized. The heterogeneous integration platform developed in this ERC-M&M’s+2 Proof of Concept proposal is suitable for a variety of small-sized MEMS components with large-volume markets, including infrared (IR) detector arrays, micro-mirror arrays, ultra-low power circuits based on NEM switches (a specific target application are low-power FPGAs), gyroscopes, accelerometers, microphones, etc. Thus, the heterogeneous integration platform is addressing a potential multi-billion € market. In contrast to the competing technologies, our heterogeneous integration platform is enabling the integration of ICs and MEMS/NEMS devices with extremely small device dimensions in the nm-range, very small via dimensions in the sub-1μm-range and placement accuracies of the MEMS/NEMS components on the target ICs in the nm-range.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Funding Scheme

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ERC-POC - Proof of Concept Grant

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) ERC-2015-PoC

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Host institution

KUNGLIGA TEKNISKA HOEGSKOLAN
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 150 000,00
Address
BRINELLVAGEN 8
100 44 Stockholm
Sweden

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Region
Östra Sverige Stockholm Stockholms län
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 150 000,00

Beneficiaries (1)

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