Servicio de Información Comunitario sobre Investigación y Desarrollo - CORDIS

HIgh throughPut LasER processing of DIamond and Silicon

From 2016-02-01 to 2019-07-31, ongoing project

Project details

Total cost:

EUR 4 440 640

EU contribution:

EUR 3 640 307,5

Coordinated in:

Germany

Call for proposal:

H2020-ICT-2015See other projects for this call

Funding scheme:

RIA - Research and Innovation action

Objective

Related information

Open Access

Coordinator

UNIVERSITAET STUTTGART
Germany

EU contribution: EUR 909 187,5


KEPLERSTRASSE 7
70174 STUTTGART
Germany

Participants

AMPLITUDE SYSTEMES SA
France

EU contribution: EUR 555 750


AV DE CANTERANNE BAT MEROPA 11
33600 PESSAC
France
CLASS 4 LASER PROFESSIONALS AG
Switzerland

EU contribution: EUR 0


BAHNHOFSTRASSE 43
3400 BURGDORF
Switzerland
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germany

EU contribution: EUR 371 742,5


OTTO BLUMENTHAL STRASSE 25
52074 AACHEN
Germany
ROBERT BOSCH GMBH
Germany

EU contribution: EUR 499 002,5


Robert-Bosch Platz 1
70839 GERLINGEN-SCHILLERHOEHE
Germany
UNIVERSITE DE LIMOGES
France

EU contribution: EUR 299 500


François Mitterrand 33
87032 Limoges
France
LASER ENGINEERING APPLICATIONS SA
Belgium

EU contribution: EUR 441 750


RUE DES CHASSEURS ARDENNAIS 10
4031 LIEGE ANGLEUR
Belgium
GLOPHOTONICS
France

EU contribution: EUR 289 750


1 AVENUE D'ESTER, ESTER TECHNOPOLE
87100 LIMOGES
France
ELEMENT SIX LIMITED
Ireland

EU contribution: EUR 132 250


SHANNON AIRPORT
SHANNON
Ireland
Kite Innovation (Europe) Limited
United Kingdom

EU contribution: EUR 141 375


3M BUCKLEY INNOVATION CENTRE BIC 2/01
HD1 3BD HUDDERSFIELD
United Kingdom
Record Number: 199135 / Last updated on: 2016-06-30