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CmOs Solutions for Mid-board Integrated transceivers with breakthrough Connectivity at ultra-low Cost

Objective

The COSMICC consortium gathers key industrial and research partners with world-leading positions in the fields of Silicon photonics, CMOS electronics, Printed Circuit Board-Packaging, Optical transceivers and Data-Centers around a strong vision: mass commercialization of Si-photonics-based transceivers is possible starting in 2019 by enhancing the existing photonic integration platform of one of the partners, STMicroelectronics.
COSMICC will develop optical transceivers that will be packaged on-board. Combining CMOS electronics and Si-photonics with innovative-high-throughput fiber-attachment techniques, the developed solutions are scalable to meet the future data-transmission requirements in data-centers and Super computing systems. With performances improved by an order of magnitude as compared with current VCSELs transceivers, COSMICC developed technology will answer tremendous market needs with a target cost per bit that the traditional WDM transceivers cannot meet. The early setting up of a new value chain will enable exploitation of the developed technologies.
In a first high reward step-modification of the fabrication platform, COSMICC consortium will achieve mid-board optical transceivers in the [2Tbit/s -2pJ/bit- 0.2€ per Gbit/s]-class with ~200Gbit/s per fiber: the introduction of one process brick (SiN layer) in the photonic process will enable low-cost packaging techniques (up to 2x12 fiber channels) and practical coarse WDM implementation (4 wavelengths with no temperature-control requirements). The built demonstrators will be tested in lab and field environments. In compliancy with the enhanced-fabrication platform, lasers will be developed by heterogeneous integration of III-V material, targeting improved temperature behavior, and doubled-bit-rate payback.
A second step-modification of the fabrication platform will consist in evaluating a disruptive process that enables SiGe layers with tunable Si-composition for achieving micrometer-scale devices.

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(opens in new window) H2020-ICT-2015

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Coordinator

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 962 607,50
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RUE LEBLANC 25
75015 PARIS 15
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Region
Ile-de-France Ile-de-France Paris
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Research Organisations
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 962 607,50

Participants (12)

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