Spintronic-Photonic Integrated Circuit platform for novel Electronics

Informazioni relative al progetto

SPICE

ID dell’accordo di sovvenzione: 713481

DOI 10.3030/713481

Progetto concluso

Data della firma CE 25 Maggio 2016

Data di avvio 1 Ottobre 2016

Data di completamento 31 Dicembre 2020

Finanziato da

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Costo totale € 3 395 178,25

Contributo UE € 3 395 178,25

Coordinato da

AARHUS UNIVERSITET
Denmark

Obiettivo

The main objective of SPICE is to realize a novel integration platform that combines photonic, magnetic and electronic components. Its validity will be shown by a conceptually new spintronic-photonic memory chip demonstrator with 3 orders of magnitude higher write speed and 2 orders of magnitude lower energy consumption than state-of-the-art spintronic memory technologies. This enables, e.g. future petabit-per-second processor-memory bandwidths, required in a decade from now, and highly energy-efficient exascale datacenters with reduced carbon footprint. Such a versatile memory will result in so-called Universal Memory: one technology for all memory applications ranging from cache to storage.
The methods to achieve this are based on the recent discovery of magnetization reversal by short optical pulses. SPICE will bring this technique to the integrated circuit level by first developing free magnetic layers that can be optically switched into a magnetic-tunnel-junction layerstack, with optically transparent top contacts. These layers will then be processed into spintronic memory elements that can be electrically read. A novel short-pulse switching architecture will be designed and implemented in a silicon photonic integrated circuit. This photonic switching layer will then be combined with the spintronic memory layer to achieve an optically switched 8-bit memory with write efficiency of 600 fJ per bit: the proof of concept of the technology.
The novelty of SPICE is the convergence of the emerging fields of opto-magnetism and spintronics with electronic and photonic integration technologies. The ambition is to develop this technology in such a way that it can be compatible with future mature electronics fabrication processes, for real-world applications beyond 2025, thereby creating a new field. The SPICE platform is therefore foundational as it can be used not only for ultrafast and energy-efficient memory, but also for RF nano-oscillators and sensor technology.

Campo scientifico

• engineering and technology › electrical engineering, electronic engineering, information engineering › information engineering › telecommunications › radio technology › microwave technology
• natural sciences › chemical sciences › inorganic chemistry › post-transition metals
• engineering and technology › electrical engineering, electronic engineering, information engineering › information engineering › telecommunications › telecommunications networks › optical networks
• natural sciences › physical sciences › electromagnetism and electronics › spintronics
• engineering and technology › electrical engineering, electronic engineering, information engineering › electronic engineering › sensors

Programma(i)

• H2020-EU.1.2. - EXCELLENT SCIENCE - Future and Emerging Technologies (FET) Main Programme
• H2020-EU.1.2.1. - FET Open

Argomento(i)

• FETOPEN-RIA-2014-2015 - FET-Open research projects

Invito a presentare proposte

H2020-FETOPEN-2014-2015

Vedi altri progetti per questo bando

Bando secondario

H2020-FETOPEN-2014-2015-RIA

Meccanismo di finanziamento

RIA - Research and Innovation action

Coordinatore

AARHUS UNIVERSITET

• Contribution nette de l'UE: € 967 132,50
• Indirizzo: NORDRE RINGGADE 1 ; 8000 Aarhus C ; Danimarca
• Regione: Danmark › Midtjylland › Østjylland
• Tipo di attività: Higher or Secondary Education Establishments
• Costo totale: € 967 132,50

Partecipanti (5)

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgio

• Contribution nette de l'UE: € 577 328,75
• Indirizzo: KAPELDREEF 75 ; 3001 Leuven
• Regione: Vlaams Gewest › Prov. Vlaams-Brabant › Arr. Leuven
• Tipo di attività: Research Organisations
• Costo totale: € 577 328,75

STICHTING RADBOUD UNIVERSITEIT

Paesi Bassi

• Contribution nette de l'UE: € 675 000,00
• Indirizzo: HOUTLAAN 4 ; 6525 XZ Nijmegen
• Regione: Oost-Nederland › Gelderland › Arnhem/Nijmegen
• Tipo di attività: Higher or Secondary Education Establishments
• Costo totale: € 675 000,00

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Francia

• Contribution nette de l'UE: € 747 026,00
• Indirizzo: RUE LEBLANC 25 ; 75015 PARIS 15
• Regione: Ile-de-France › Ile-de-France › Paris
• Tipo di attività: Research Organisations
• Costo totale: € 747 026,00

QUANTUMWISE A/S

Partecipazione conclusa

Danimarca

• Contribution nette de l'UE: € 162 956,85
• Indirizzo: FRUEBJERGVEJ 3 ; 2100 Copenhagen
• PMI L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione. Sì:
  Regione
  Danmark › Hovedstaden › Byen København
• Regione: Danmark › Hovedstaden › Byen København
• Tipo di attività: Private for-profit entities (excluding Higher or Secondary Education Establishments)
• Costo totale: € 162 956,85

SYNOPSYS DENMARK APS

Danimarca

• Contribution nette de l'UE: € 265 734,15
• Indirizzo: FRUEBJERGVEJ 3 ; 1200 Copenhagen V
• Regione: Danmark › Hovedstaden › Byen København
• Tipo di attività: Private for-profit entities (excluding Higher or Secondary Education Establishments)
• Costo totale: € 265 734,15