Obiettivo As a feasibility and application study, the HIPERLOGIC project will yield an innovative masterslice chip structure of high functional density. The objectives of high system performance at low power consumption will be achieved due to an innovative silicon-on-insulator CMOS process with three-dimensional integration and a circuit design optimally tuned to this technology. The CAD environment will integrate both an existing prototype technology-independent system level synthesis, and novel technology. In this project, all partners will bring together their expertise and knowledge in order to achieve the breakthrough in high performance, low power, application specific integrated circuits by the synergy of their joint activities.The HIPERLOGIC project is aimed to push today's CMOS based integrated circuits into new regions of integration density, circuit performance and reduced power consumption. It will extend the limits of today's best performance/power ratios by a factor of 1000. Especially achieving low power consumption of CMOS circuits while maintaining speed is crucial for personal portable computing systems in consumer, industrial, and automotive applications.In order to realize this rate of progress, synergy and harmonization of CMOS technology, circuit and system design are the essence of this project. The participating institutes have distributed strengths in all these areas in order to master the complex interactions of required technologies like silicon-on-insulator, three-dimensional integration, new circuit topologies, power-driven synthesis and compatible system design. While the overall result is aimed for an introduction in the year 2000, spin-offs will be available at many milestones for early industrial exploitation. Exemplary circuits and system demonstrators will be identified. Campo scientifico natural sciencesmathematicspure mathematicstopology Programma(i) FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998 Argomento(i) 4.2 - Reactiveness to Industrial Needs Invito a presentare proposte Data not available Meccanismo di finanziamento CSC - Cost-sharing contracts Coordinatore Institut für Mikroelektronik Stuttgart Contributo UE Nessun dato Indirizzo Allmandring 30A 70569 Stuttgart Germania Mostra sulla mappa Costo totale Nessun dato Partecipanti (3) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto Industrial Microelectronics Center Svezia Contributo UE Nessun dato Indirizzo Isafjordsgatan 22 16421 Kista Mostra sulla mappa Costo totale Nessun dato Institut for Parallel and Distributed High-Performance Systems Germania Contributo UE Nessun dato Indirizzo Breitwiesenstrasse 20-22 70565 Stuttgart Mostra sulla mappa Costo totale Nessun dato Universite Joseph Fourier Francia Contributo UE Nessun dato Indirizzo Batiment Administratif, Avenue Centrale (Domaine U 621 38041 Grenoble Mostra sulla mappa Costo totale Nessun dato