Objetivo Objectives and content The future production of electronic systems combines a clear trend of an increasing complexity with a size reduction of the subcircuits. This results in an increasing chip functionality density and I/O pin count. The needs for chip packaging and interconnection dictated by this trend, cannot be met by the traditional assembly technologies. All viable solutions to replace the traditional technologies are flip-chip (FC) solutions. Although this technology has been existing for some decennia now, there has never been a major breakthrough because of the required expensive IC back-end processing and dedicated assembly technology. Today the most widely used FC technology is the IBM "C4" process, using solder bumps. This process has some important drawbacks. It requires expensive additional wafer processing and cannot be used on non-solderable substrates like flex and glass. A very promising alternative is offered by the recent developments of adhesive technologies. Flip-chip with isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs) have been used for several years now for mounting driver IC's on liquid crystal displays (chip-on-glass, COG). However ICAs are presently not suitable for pitches below 200 m and need an underfill; ACAs do yet not achieve low contact resistance. A third category of adhesives, nonconductive adhesives (NCAs) are used only marginally until now. It is obvious that there is a need for further development of adhesive joining technologies to solve the shortcomings listed above. It is believed that a conductive adhesive joining technology will lead to higher packaging densities at lower costs. Furthermore adhesive joining is considered as one of the candidates for replacing Pb-based solders and make electronic assembly technology more environmental friendly. In the proposed DACTEL project, new adhesives (ICAs, ACAs and NCAs) and assembly technologies will be developed for various kinds of flip-chip assemblies: chip-on-glass (COG), chip-on-flex (COF), chip-on-board (COB) and Ball Grid Array (BGA) assemblies. The joining technology to be developed in this project will have the following innovations: - Low cost back-end processing of standard available wafers with aluminium bondpads to enable flip chip assembly (with or without bumps). - Development of adhesives and adhesive joining technology (isotropic, anisotropic and non-conductive) with improved electrical, processing, repairability and reliability properties. - Reduction of process steps by combining the interconnect and the underfill function within one adhesive (anisotropic or non conductive). - Introduction of flip chip bonding onto low cost substrates like polyester flex and laminate. Improvement of interconnection density down to 100 m pitch. Improvement of contact resistance and current density - Development of mathematical tools for calculation of stress distribution and probability of short and open circuits. Ámbito científico natural scienceschemical sciencesinorganic chemistrypost-transition metalsengineering and technologymaterials engineeringliquid crystals Programa(s) FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998 Tema(s) 0201 - Materials engineering Convocatoria de propuestas Data not available Régimen de financiación CSC - Cost-sharing contracts Coordinador ALCATEL BELL NV Aportación de la UE Sin datos Dirección FRANCIS WELLESPLEIN 1 2018 ANTWERPEN Bélgica Ver en el mapa Coste total Sin datos Participantes (12) Ordenar alfabéticamente Ordenar por aportación de la UE Ampliar todo Contraer todo ALCATEL SPACE INDUSTRIES S.A. Francia Aportación de la UE Sin datos Dirección 5,26 Avenue J.F. Champollion 31037 TOULOUSE Ver en el mapa Coste total Sin datos Alcatel Business Systems Francia Aportación de la UE Sin datos Dirección 1,Rue du Dr. Albert Schweizer 1 67408 Illkirch Ver en el mapa Coste total Sin datos Blaupunkt-Werk GmbH Alemania Aportación de la UE Sin datos Dirección 200,Robert-Bosch-Straße 200 31132 Hildesheim Ver en el mapa Coste total Sin datos Dicryl SA España Aportación de la UE Sin datos Dirección Parque Tecnologico de Boecillo 47151 Valladollid Ver en el mapa Coste total Sin datos Interuniversitair Mikro-Electronika Centrum VZW Bélgica Aportación de la UE Sin datos Dirección 41,St. Pietersnieuwstraat 41 9000 Gent Ver en el mapa Coste total Sin datos Mietec NV Bélgica Aportación de la UE Sin datos Dirección 15,Westerring 15 9700 Oudenaarde Ver en el mapa Coste total Sin datos Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek Países Bajos Aportación de la UE Sin datos Dirección 501,Laan van Westenenk 501 7300 AM Apeldoorn Ver en el mapa Coste total Sin datos Nederlandse Philips Bedrijven BV Países Bajos Aportación de la UE Sin datos Dirección 1A,Kastanjelaan 5600 MD Eindhoven Ver en el mapa Coste total Sin datos Picopak Oy Finlandia Aportación de la UE Sin datos Dirección 1,Teollisuuskatu 08150 Lohja Ver en el mapa Coste total Sin datos Robert Bosch GmbH Alemania Aportación de la UE Sin datos Dirección 1,Robert-Bosch-Platz 70049 Stuttgart Ver en el mapa Coste total Sin datos Société Rennaise d'Electronique Professionnelle Francia Aportación de la UE Sin datos Dirección Zone Industrielle de Bellevue 35220 Châteaubourg Ver en el mapa Coste total Sin datos W.C. Heraeus GmbH Alemania Aportación de la UE Sin datos Dirección 12-14,HeraeusstraÙe 63450 Hanau Ver en el mapa Coste total Sin datos