Objectif FLEXIL project deals with the development of highly integrated man-machine interfaces based on flex interconnection technology.Applications focused are:- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,- very flat, integrated small displays for smart cards or portable electronics that require also low cost- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).Objectives:FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).Particularly FLEXIL is focused on:- very fine pitch tapes (54 µm), and flex for flip chip (80 µm),- surface mount and anisotropic gluing processes,L%- reliability of the technologies developed for severe environments.Applications focused are:- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,- very flat, integrated small displays for smart cards or portable electronics that require also low cost- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.Work description:Five workpackages represent the structure of the project.Technology Tasks and Work Packages are entitled as follows:- WP1 Specifications & Requirements- WP2 Development of LCD ASIC Drivers (2)- WP3 Technologies development3.1 High density (54um)Flex / Tab and flex for flip-chip technology development3.2 Flex Tab and flex for flip chip design and fabrication3.3 Assembly process developments3.3.a Bumpless Flex Tab chip assembly3.3.b Flip chip on flex connections (80 µm)3.3.c Surface mount microcomponents assembly on flex3.4 Flex to glass anisotropic adhesive connection development (54 um pitch)3.5 High density bumping process for flip chip (80um pitch)- WP4 Techno Evaluation & Demonstrator Fabrication- WP5 Technology Validation & ExploitationThe project synopsis, depicts the synergetics structure of the programme, from the development and the qualification of technologies to the manufacture of functional products.Each work package gathers the relevant partners that are needed for reaching the Task or Demonstrator objectives in view of the whole project goal. Champ scientifique engineering and technologymaterials engineering Programme(s) FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002" Thème(s) 1.1.2.-4.7.2 - Subsystems technologies Appel à propositions Data not available Régime de financement CSC - Cost-sharing contracts Coordinateur THALES SYSTEMES AEROPORTES S.A. Contribution de l’UE Aucune donnée Adresse 2, AVENUE GAY-LUSSAC LA CLEF DE SAINT PIERRE 78990 ELANCOURT France Voir sur la carte Coût total Aucune donnée Participants (6) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM Hongrie Contribution de l’UE Aucune donnée Adresse MUEGYETEM RAKPART 3 1111 BUDAPEST Voir sur la carte Coût total Aucune donnée ELCOTEQ NETWORK CORPORATION Finlande Contribution de l’UE Aucune donnée Adresse LAENSI-LOUHENKATU 31 08101 LOHJA Voir sur la carte Coût total Aucune donnée FCI MICRO ELECTRONICS France Contribution de l’UE Aucune donnée Adresse RUE DES CLOSEAUX 37 78200 MANTES LA JOLIE Voir sur la carte Coût total Aucune donnée INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW Belgique Contribution de l’UE Aucune donnée Adresse KAPELDREEF 75 3001 LEUVEN Voir sur la carte Coût total Aucune donnée THALES AVIONICS LCD SA France Contribution de l’UE Aucune donnée Adresse BOULEVARD HAUSSMANN 173 75008 PARIS Voir sur la carte Coût total Aucune donnée THALES AVIONICS SA France Contribution de l’UE Aucune donnée Adresse 1 AVENUE CARNOT 91883 MASSY Voir sur la carte Coût total Aucune donnée