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3D- Information based Safety and Security by Solid State Microsystems

Objectif

MISSY will develop an intelligent, robust and affordable solid state microsystem enabling fast and parallel acquisition of 3D-information. MISSY will improve the safety and security of every day life and open up new markets in the monitoring and control of industrial processes: automation, transportation, traffic, etc. The innovation is based on the combination of advanced CMOS-technology, photonics and a new method of gaining range information from light propagation time measurement by MDSI-Multiple Double Short Time Integration. Performance will be demonstrated and validated in 2 steps of increasing complexity using respective 3D-line and 3D-array systems in safety control of automatic doors and then space monitoring for intrusion alarm detection. MISSY will be a break through as regards the speed, reliability and accurateness of sensor operations, eliminating false alarms and creating excellent business opportunities in various high volume markets. MISSY will develop an intelligent, robust and affordable solid state microsystem enabling fast and parallel acquisition of 3D-information.

OBJECTIVES
Numerous industrial applications in daily life, such as safety and security surveillance, traffic and transport management require more affordable, more robust and more accurate sensors. MISSY will address these needs by developing a microsystem for fast and robust 3D image acquisition based on CMOS photosensitive circuits, infrared laser illumination and an innovative time of flight measurement method: MDSI. This microsystem will be flexible, optimised for high volume applications, highly miniaturised and support network communications. The goal is to provide 32 pixel 3D-line microsystem with 1 MHz data rate and 80 dB dynamics at a target cost of 50 Euros/unit and 32x32 pixel 3D-array microsystem for less than 100 Euros. The expected benefits for target applications, validated in close-to-real world conditions are: close to 100% accuracy, impartiality to varying ground reflectivity and to ambient light, easy integration into application system simplified image data processing.

DESCRIPTION OF WORK
MISSY specifications will be established in a close collaboration of all partners, who combine knowledge on advanced microelectronics, photonics and information technology, as well as, expertise from technical & industrial requirements for the development and mass production of electronic products in the target market segments: automatic door systems & surveillance systems. MISSY will develop a novel range imaging microsystem integrating a CMOS image sensor with ultrashort electronic shutter, an infrared laser pulse illumination, a programmable logic unit (FPGA) for control & signal evaluation and optics by a hyprid Multi Chip Module assembly. The sensors circuits will be designed & manufactured using a 0.5µ CMOS process in two subsequent versions: a 32 line and a 32x32 array configuration. The 3D-image acquisition is based on a laser light propoagation time measurement using the innovative Multiple Double Short Time Integration (MDSI) method. The algorithms will be developed & implemented in the FPGA of the microsystems which also will provide the communication interface to a local processor or the central host computer of a network for further processing of the range data and appropriate actions. The MISSY microsystem will be integrated in two application systems to allow evaluation of the technology in close-to-real world environments. The development will be carried out in two phases. First a 3D-line microsystem will be developed & tested in a demonstrator A for more reliable safety control of an automatic door. With the feedback of the test & evaluation results a 3D array microsystem will be developed and validated in a demonstrator B for advanced security surveillance (intrusion detection, monitoring of elderly people). The total business potential for products derived from MISSY technology is expected to be huge for the various market sectors. The partners will establish and exploitation plan based on their market position and world-wide business relations.

Thème(s)

Data not available

Appel à propositions

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Régime de financement

CSC - Cost-sharing contracts

Coordinateur

SIEMENS AKTIENGESELLSCHAFT
Contribution de l’UE
Aucune donnée
Adresse
WITTELSBACHERPLATZ 2
80333 MUENCHEN
Allemagne

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Coût total
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Participants (3)