Obiettivo INSPIRED builds a platform for high end optical receiver chips for consumer applications like optical storage or data transmission. The technology development part integrates a fast PIN-photodiode into a modern BICMOS process incl. packaging with high optical quality and additional features like filters. In the product related part a demonstrator for DVD applications is developed on this process base. It assembles photodiode, amplifier and data processing blocks on one chip and targets on high performance in terms of data rate, power consumption and signal to noise ratio. This demonstrator is implemented into a DVD test drive as customer like application. The more fundamental part develops testing concepts & hardware for product characterisation and new design concepts for future silicon optoelectronic products.Objectives:In the first European initiative to join silicon optoelectronics competence, the INSPIRED consortium will develop a low-cost integrated photodiode with extremely high data rates (500 MBit/s to 1 GBit/s), low power consumption and high signal-to-noise ratio for mass application. The main challenge of this innovative project is to integrate a fast photodiode in a high speed IC technology which allows the design of amplifier circuits and signal processing blocks. A packaging technology with high optical quality is also an essential part of this project. From the big range of possible applications, the target application DVD has been chosen for this project. The INSPIRED project addresses several different IST objectives: optical storage technology, optical data communication, low costs, reliability, enhanced quality of service, advanced opto- and micro-electronics.Work description:The target parameters of the integrated photodiode will be based on the process ideas, device simulation, packaging features, and requirements of the target application DVD.- Development of new process modules (fast npn transistor, fast PIN-photodiode, antireflection coating) that are vital for products with high data rates and sensitivity- Development of process steps for the new modules, considering feasibility, process concept, process and device simulation, process integration under high volume fabrication aspects (leading to low cost products).Three production cycles including wafer test:1) single device elements (photodiodes, transistors) as test structures,2) photodiodes in combination with new high gain-bandwidth transimpedance amplifier circuits (prototype),3) photodiodes, amplifiers, signal processing blocks (demonstrator for DVD applications)- Test chips based on new concepts in BICMOS and CMOS circuit design for testing on wafer level (probe cards) and with packaging (computerised measurement setup)- Definition and development of a demonstrator, e.g. a receiver for DVD drives with high data rates of approximately 500Mbit/s as well as fabrication on the basis of new technology- Wafer based packaging technology to improve performance of packaged PD: addition of features like antireflection coating and backside trench isolation for noise reduction. Customer requirements are taken into consideration.The INSPIRED management committee will monitor the progress of the project, assess the quality of the achieved results, and represent the consortium before the Commission.Milestones:- Technology Development: Process base for engineering samples, Process freeze, Component library, Process qualification, Process yield (> 75%)- Prototype & Demonstrator Development: Tape outs/First processed wafers/packaged chips of all three production cycles and new design structures, chip implementation in DVD drive, DVD drive working, product qualification, sample shipment to customer- Prototype & Demonstrator characterisation: data rate (> 500 MBit/s), quantum efficiency (> 80%). Campo scientifico natural sciencesphysical scienceselectromagnetism and electronicsoptoelectronicsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsignal processingengineering and technologymaterials engineeringcoating and filmsnatural scienceschemical sciencesinorganic chemistrymetalloidsnatural sciencescomputer and information sciencesdata sciencedata processing Programma(i) FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002" Argomento(i) 2000-4.8.4 - Optoelectronic technologies Invito a presentare proposte Data not available Meccanismo di finanziamento CSC - Cost-sharing contracts Coordinatore INFINEON TECHNOLOGIES AG Contributo UE Nessun dato Indirizzo ST. MARTIN STRASSE 53 81609 MUENCHEN Germania Mostra sulla mappa Costo totale Nessun dato Partecipanti (6) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto INFINEON TECHNOLOGIES MICROELECTRONIC DESIGN CENTERS AUSTRIA GMBH Austria Contributo UE Nessun dato Indirizzo SIEMENSSTRASSE 2 9500 VILLACH Mostra sulla mappa Costo totale Nessun dato KATHOLIEKE UNIVERSITEIT LEUVEN Belgio Contributo UE Nessun dato Indirizzo OUDE MARKT 13 3000 LEUVEN Mostra sulla mappa Costo totale Nessun dato OSRAM OPTO SEMICONDUCTORS GMBH Germania Contributo UE Nessun dato Indirizzo WERNERWERKSTRASSE 2 93049 REGENSBURG Mostra sulla mappa Costo totale Nessun dato PHILIPS ELECTRONICS NEDERLAND B.V. Paesi Bassi Contributo UE Nessun dato Indirizzo Boschdijk 525 Postbus 90050 EINDHOVEN Mostra sulla mappa Collegamenti Sito web Opens in new window Costo totale Nessun dato SHELLCASE LIMITED Israele Contributo UE Nessun dato Indirizzo MANHAT TECHNOLOGY PARK 96251 JERUSALEM Mostra sulla mappa Costo totale Nessun dato TECHNISCHE UNIVERSITAET WIEN - INSTITUT FUER ELEKTRISCHE MESS- UND SCHALTUNGSTECHNIK Austria Contributo UE Nessun dato Indirizzo GUSSHAUSSTRASSE 25/354 1040 WIEN Mostra sulla mappa Costo totale Nessun dato
