Objetivo Adhesive conductive pastes (ACP) used for assembling micro-modules to RF antennas of dual interface smart cards (contact and RF contact less) require oven curing before becoming conductive. This prevents cards from being function tested "in-line" and can result in card body distortion. The project aims to develop/characterise/qualify new adhesive conductive pastes/processing routes/equipment for complete " in-line" production and testing of cards. A model for predicting adhesive bond properties will be developed. The scientific phenomena of micro-wave curing will be explored. The project will reduce scarps rates, improve product reliability, consolidate European leadership and employment in smart cards, open new avenues in electronic packaging and reduce the use of lead. It will promote citizen services (IST) using cost effective and reliable smart cards.A new Isotropic Conductive adhesive has been produced and validated. New process route developed, tested and qualified by end -users. New equipment designed, installed and tested in real industrial environment. A model for predicting smart card properties developed. Scientific base for micro-ware curing has being developed. Ámbito científico social scienceseconomics and businessbusiness and managementemployment Programa(s) FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002" Tema(s) 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation Convocatoria de propuestas Data not available Régimen de financiación CSC - Cost-sharing contracts Coordinador CYBERNETIX S.A. - INGENIERIE DES SYSTEMES AUTOMATIQUES ET ROBOTIQUES Aportación de la UE Sin datos Dirección Rue Albert Einstein 306, Technopole de Chateau-Gom 13382 MARSEILLE Francia Ver en el mapa Coste total Sin datos Participantes (5) Ordenar alfabéticamente Ordenar por aportación de la UE Ampliar todo Contraer todo CHALMERS UNIVERSITY OF TECHNOLOGY Suecia Aportación de la UE Sin datos Dirección Hoersalsvaegen 7 412 96 GOETEBORG Ver en el mapa Coste total Sin datos DELO INDUSTRIEKLEBSTOFFE GMBH & CO. KG Alemania Aportación de la UE Sin datos Dirección Ohmstrasse 3 86882 LANDSBERG Ver en el mapa Coste total Sin datos FABRICA NACIONAL DE MONEDA Y TIMBRE España Aportación de la UE Sin datos Dirección Jorge Juan 106 28009 MADRID Ver en el mapa Coste total Sin datos SETEC OY Finlandia Aportación de la UE Sin datos Dirección Suometsentie 1 01741 VANTAA Ver en el mapa Coste total Sin datos TECHNICAL RESEARCH CENTRE OF FINLAND Finlandia Aportación de la UE Sin datos Dirección Kaitoväylä 1 90571 OULU Ver en el mapa Coste total Sin datos