Community Research and Development Information Service - CORDIS

FP6

HIDING DIES

Project ID: 507759
Funded under

High Density Integration of Dies into Electronics Substrates

From 2003-12-18 to 2006-12-31 | HIDING DIES Website

Project details

Total cost:

EUR 3 358 044

EU contribution:

EUR 1 870 154

Coordinated in:

Germany

Funding scheme:

STREP - Specific Targeted Research Project

Objective

Coordinator

TECHNISCHE UNIVERSITAET BERLIN
Germany
Gustav-Meyer-Allee 25
13355 BERLIN
Germany
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Administrative contact: Andreas OSTMANN
Tel.: +49-303-1472836
Fax: +49-303-1472835

Participants

AT AND S AUSTRIA TECHNOLOGIE AND SYSTEMTECHNIK AKTIENGESELLSCHAFT
Austria
Austria
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Administrative contact: Arno KRIECHBAUM
CHEMNITZER WERKSTOFFMECHANIK GMBH
Germany
Germany
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Administrative contact: Michael DOST
DATACON SEMICONDUCTOR EQUIPMENT GMBH
Austria
Austria
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Administrative contact: Christoph SCHEIRING
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium
St-Pieternieuwstraat 41
B-9000 Gent
Belgium
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Administrative contact: Johan DE BAETS
NOKIA CORPORATION
Finland
Finland
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Administrative contact: Pekka LAUKKALA
PHILIPS ELECTRONICS NEDERLAND B.V.
Netherlands
Glaslaan 2
5600 MD Eindhoven
Netherlands
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Administrative contact: Anton VAN DER LUGT
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