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  • A new process for the realisation of Electrical connections between the layers of printed circuit boards and a method to implant micro components using the proposed embedded micro connector injection process
FP6

EMCI

Project ID: 508172
Funded under

A new process for the realisation of Electrical connections between the layers of printed circuit boards and a method to implant micro components using the proposed embedded micro connector injection process

From 2004-09-01

Project details

Total cost:

EUR 1 804 440

EU contribution:

EUR 0

Coordinated in:

Germany

Objective

Coordinator

I.T.C. INTERCIRCUIT ELECRONIC GMBH
Germany
Wasserburger Landstrasse 280
MUENCHEN
Germany
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Participants

FEINWERKBAU WESTINGER & ALTENBURGER GMBH
Germany
Neckarstrasse 43
OBERNDORF
Germany
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KEKON CERAMIC CAPACITORS
Slovenia
Grajski trg 15
ZUSEMBERK
Slovenia
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EUROPRINT N.V.
Belgium
Zandvoorstraat 21
MECHELEN
Belgium
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FRIEDRICH-ALEXANDER UNIVERSITÄT ERLANGEN - NÜRNBERG
Germany
Schlossplatz 4
ERLANGEN
Germany
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TECHNISCHE UNIVERSITÄT ILMENAU
Germany
Max-Planck-Ring, 14
100565 ILMENAU
Germany
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BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS
Hungary
Goldman t.3
BUDAPEST
Hungary
Administrative contact: Zsolt ILLYEFALVI-VITEZ
Tel.: +36-14632740
Fax: +36-14634118
E-mail
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