MULFUNProject ID: 516089
Total cost:EUR 2 423 029
EU contribution:EUR 1 253 200
Topic(s):AERO-2003-126.96.36.199f - Equipment weight and power take-up reduction
AERO-2003-188.8.131.52e - Structural weight reduction
Call for proposal:FP6-2003-AERO-1See other projects for this call
Funding scheme:STREP - Specific Targeted Research Project
The needs to reduce cost and provide added value by integration of functions is demanding for a weight and volume constrained design onaircraft and satellite. On the last years, lightweight composite materials have been increasingly used to reduce the structural weight andvolume of equipment components. However, concentrating solely on structural mass reduction does not lead to further lowering ofequipment mass because the structure typically represents as little as 10 to 15% of the total mass. The envisaged solution is to designstructural elements that can integrate multiple functions, known as multifunctional structures, MFS.In the conventional avionics equipment design, structural, thermal and electronic functions are generally designed and fabricated intoseparate elements:Load support based on shells and metallic frames structuresThermal management based on radiators or cold platesElectronics enclosures based on metallic black boxes and rigid PCBElectronic/power distribution based on Cables bundles / harnessThese functions intend to be integrated under the MSF design, consisting in structural composite panels and composite housings that haselectric properties ( Patch within flexible integrated circuits mounted directly on the composite panel) and thermal properties ( heattransfer elements embedded on the composite panel as thermal doublers and straps made of high conductive graphite fibres oralternatively active thermal integrated refrigeration circuits as fluid loops).The proposal objective is the development of lightweight -fully integrated advanced equipment for aircraft and spacecraft (avionicselectronic housings) based on these multifunctional structures with disruptive design concepts. It is propose an innovation type of project,specification focused, within a building block approach, where four breadboard will be design and manufactured.