Objectif The project will investigate the deposition of functional materials for thin-film electronics by so-called additive methods, also referred to as "printable electronics". Current manufacturing processes for thin-film electronics are based on photolithographic processes. These processes have good resolution, however at the same time west most materials that are used and need many process steps (sheet deposition of metal and resist, exposure, development, etching, stripping). Also, some new materials such as light-emitting polymers do not withstand all photolithographic process steps. These cost- and environmental considerations introduce the need for new cost-effective patterning methods that do not waste material. In an ideal scenario, the functional material is added to the substrate in one step, possibly followed by a conversion step. Additive methods suitable for this purpose can be borrowed from the printing industry. However, printing methods are at best developed to resolutions of order ten micrometer, as smaller features cannot be distinguished by the human eye. Although the resolution of some printing methods may be extended somewhat beyond their "graphical reach", there is a need for new methods that can enter the (sub-) micron range. The project consists of two parts. Early stage researchers 1 and 3 will investigate new additive methods for (sub-) micrometer deposition. One of these methods is the use of contact printing methods in the field of soft lithography. The other one is the generation and guided deposition of small droplets generated by electro spraying. Early stage researchers 2 will focus on the functional characterisation of materials deposited by printing methods. During the second part of the project, as printing methods are expected be able to deliver multiplayer integration of patterned materials, we want to investigate the relation between the deposition method and the final electronic functionality and structure of the material in a device. Champ scientifique engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsbiosensorsengineering and technologymechanical engineeringmanufacturing engineeringnatural scienceschemical sciencespolymer sciencesengineering and technologymaterials engineeringcoating and filmsengineering and technologynanotechnologynano-materials Mots‑clés Nanotechnology Risk Assessment additive methods manufacturing method materials processing micron photolithography printable electronics Programme(s) FP6-MOBILITY - Human resources and Mobility in the specific programme for research, technological development and demonstration "Structuring the European Research Area" under the Sixth Framework Programme 2002-2006 Thème(s) MOBILITY-1.2 - Marie Curie Host Fellowships - Early stage research training (EST) Appel à propositions FP6-2002-MOBILITY-2 Voir d’autres projets de cet appel Régime de financement EIF - Marie Curie actions-Intra-European Fellowships Coordinateur PHILIPS ELECTRONICS NEDERLAND B.V. Contribution de l’UE Aucune donnée Adresse Boschdijk 525 EINDHOVEN Pays-Bas Voir sur la carte Coût total Aucune donnée