Objetivo The growing complexity of mobile communication and wireless devices has resulted in a growing and important requirement for low cost, low consumption and reduced size microelectronic and microsystem components in these products. This requires a high level of integration and poses significant challenges at all technology steps from materials through processing to packaging. The goal of CAMELIA (Monolithic Above IC Ultra High Value Capacitors for Mobile and Wireless Communication Systems) is to respond to this technology integration challenge in the specific area of capacitor technology. This is a critical area for future product innovation within the Information and Communications Technologies sector. For example, in a mobile phone, 80% of the surface is devoted to single passive components and especially capacitors.The main targeted application of CAMELIA is on-chip capacitors. By fabricating thin-film capacitors on-chip, one gains not only high-frequency decoupling capacitors, but also space saving, and significant improvements in performance over discrete chip capacitors. CAMELIA addresses the above challenge of manufacturing a thin film, high capacitance, above chip (hence low temperature) capacitor component by developing a novel low-cost ferroelectric multi-component oxide based materials science and processing technology, enabling the integration of decoupling capacitors with a very small form factor in an above-IC strategy for System on Chip and wireless microsystems.The overall aim of CAMELIA is to research and develop a novel low temperature (#lt;400oC) high k (above 2000) dielectric material and processing technology for future high density or ultra low profile MIM (Metal/Insulator/Metal) decoupling capacitor applications. To the best of our knowledge, this has not been demonstrated to-date. Ámbito científico engineering and technologynanotechnologynano-materialsnanocrystalsengineering and technologymaterials engineeringcoating and filmsengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsmobile phonesengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyengineering and technologymaterials engineeringceramics Programa(s) FP6-NMP - Nanotechnologies and nanosciences, knowledge-based multifunctional materials and new production processes and devices: thematic priority 3 under the 'Focusing and integrating community research' of the 'Integrating and strengthening the European Research Area' specific programme 2002-2006. Tema(s) NMP-2004-3.4.2.2-3 - Multifunctional ceramic thin films with radically new properties Convocatoria de propuestas FP6-2004-NMP-TI-4 Consulte otros proyectos de esta convocatoria Régimen de financiación STREP - Specific Targeted Research Project Coordinador UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK Aportación de la UE Sin datos Dirección College Road, CORK Irlanda Ver en el mapa Enlaces Sitio web Opens in new window Coste total Sin datos Participantes (4) Ordenar alfabéticamente Ordenar por aportación de la UE Ampliar todo Contraer todo 3D PLUS Francia Aportación de la UE Sin datos Dirección 641 RUE HELENE BOUCHER BUC Ver en el mapa Enlaces Sitio web Opens in new window Coste total Sin datos COMMISSARIAT A L' ENERGIE ATOMIQUE' Francia Aportación de la UE Sin datos Dirección 31-33 RUE DE LA FEDERATION PARIS Ver en el mapa Enlaces Sitio web Opens in new window Coste total Sin datos ELA MEDICAL SAS Francia Aportación de la UE Sin datos Dirección 98 - 100 Rue Maurice Arnoux MONTROUGE Ver en el mapa Enlaces Sitio web Opens in new window Coste total Sin datos INSTITUT JOZEF STEFAN Eslovenia Aportación de la UE Sin datos Dirección Jamova 39 LJUBLJANA Ver en el mapa Enlaces Sitio web Opens in new window Coste total Sin datos