Descrizione del progetto Next-Generation Nanoelectronics Components and Electronics Integration3-D integration in high performance digital systemsFor developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for integration of complex chips is a promising technique for removing the bottlenecks in two-dimensional (2-D) integration. Advantages of third-dimension (3-D) integration are in first order form factor and power dissipation.The project ELITE aims at miniaturization and density increase beyond conventional limits by means of exhaustive die stacking. It takes as development vehicle an advanced solid state drive which will widely substitute traditional hard disk drives for purpose of mobile and hand-held applications and which is considered as the enabler of the increasingly developing era of mobile data. The system architecture includes a large amount of non-volatile flash memory, one or more microcontrollers and external analog high-speed interface.One of the main topics of ELITE is the development of a technology for vertical die stacking and for vertical interconnect. Starting from the expertise and experience of the consortium new technology modifications or alternative technologies are investigated. Also assembly technology is investigated considering possible later usage in mass-production with its specific requirements on manufacturability and cost. Conceptual and physical simulations are deployed for planning and ensuring the system architecture and specifying a demonstrator to prove the feasibility of the concept. Firmware inside the chip is used to optimize performance by means of parallel tasks, guarantee highly reliable data access as well as controlling power dissipation.As a final step, generalization of the results which are reached with the solid-state drive vehicle can be generalized in order to be re-used for applications from different technical domains and markets. Mostra l’obiettivo del progetto Nascondi l’obiettivo del progetto For developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for integration of complex chips is a promising technique for removing the bottlenecks in two-dimensional (2-D) integration. Advantages of third-dimension (3-D) integration are in first order form factor and power dissipation.The proposed project ELITE aims at miniaturization and density increase beyond Moore by means of exhaustive die stacking. It takes as development vehicle an advanced solid state drive which will widely substitute traditional hard disk drives for purpose of mobile and hand-held applications and which is considered as the enabler of the up-coming era of mobile data. The system architecture will include a large amount of non-volatile flash memory, one or more microcontrollers and external analog high-speed interface.One of the main topics of ELITE will be the development of a technology for vertical die stacking and for vertical interconnect. Starting from the expertise and experience of the consortium new technology modifications or alternative technologies will be investigated. Also assembly technology will be investigated considering possible later usage in mass-production with its specific requirements on manufacturability and cost.Conceptual and physical simulations will be deployed for planning and ensuring the system architecture and specifying a demonstrator which will prove the feasibility of the concept. Firmware inside the chip will be used to optimize performance by means of parallel tasks, guaranty highly reliable data access as well as controlling power dissipation.As a final step, generalization of the results which are reached with the solid-state drive vehicle will be generalized in order to be re-used for applications from different technical domains and markets. Programma(i) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Argomento(i) ICT-2007.3.1 - Next-generation nanoelectronic components and electronics integration Invito a presentare proposte FP7-ICT-2007-1 Vedi altri progetti per questo bando Meccanismo di finanziamento CP - Collaborative project (generic) Coordinatore COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES Contributo UE € 1 369 639,00 Indirizzo RUE LEBLANC 25 75015 PARIS 15 Francia Mostra sulla mappa Regione Ile-de-France Ile-de-France Paris Tipo di attività Research Organisations Contatto amministrativo Marie-Laure Page (Ms.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato Partecipanti (5) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto QIMONDA FLASH GMBH Partecipazione conclusa Germania Contributo UE € 480 958,00 Indirizzo KOENIGSBRUECKER STRASSE 180 01099 DRESDEN Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Uwe Poepping (-) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato HYPERSTONE GMBH Germania Contributo UE € 514 731,00 Indirizzo LINE-EID-STRASSE 3 78467 KONSTANZ Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Harald Westerholt (Dr.) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato Numonyx Italy Srl Italia Contributo UE € 389 568,00 Indirizzo VIA CAMILLO OLIVETTI 2 20864 AGRATE BRIANZA Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Francesco Reina (Mr.) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato KUNGLIGA TEKNISKA HOEGSKOLAN Svezia Contributo UE € 430 937,00 Indirizzo BRINELLVAGEN 8 100 44 Stockholm Mostra sulla mappa Regione Östra Sverige Stockholm Stockholms län Tipo di attività Higher or Secondary Education Establishments Contatto amministrativo Thomas Sjöland (-) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato UNIVERSITY OF LANCASTER Regno Unito Contributo UE € 414 167,00 Indirizzo BAILRIGG LA1 4YW Lancaster Mostra sulla mappa Regione North West (England) Lancashire Lancaster and Wyre Tipo di attività Higher or Secondary Education Establishments Contatto amministrativo Sarah Taylor (Dr) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato