Project description
Next-Generation Nanoelectronics Components and Electronics Integration
NANOPACK - Large Scale Integrating IP Project: Nano Packaging Technology for Interconnect and Heat Dissipation
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and multi-core logic. These efforts must combine high density electrical interconnects with low resistance thermal interfaces to remove heat from the intricate layered assemblies. Power electronics applications in hybrid vehicles and power supplies are also being pushed to new integration densities that are largely limited by the ability to transfer heat across interfaces to liquid coolers and heat sinks. Improved thermal management and integration densities for these applications will also be important to improve energy and manufacturing efficiency and component reliability.The proposed project aims at developing new technologies and materials for low thermal resistance interfaces and electrical interconnects by exploring systems such as carbon nanotubes, nanoparticles and nano-structured surfaces using different enhancing contact formation mechanisms combined with high volume compatible manufacturing technologies such as electro-spinning. Recent groundbreaking work on nested channel interfaces to control particle interactions during the formation of interfaces will be utilized to exploit the beneficial properties of the new materials. In addition, state-of-the-art modelling and simulation techniques with world class supercomputers will be combined with the development of experimental test structures to measure the performance of new interface technologies and validate design tools. Finally the technology will be used in several different applications to demonstrate improved performance of high power radio frequency switches, microprocessors and hybrid vehicle power electronics.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology electrical engineering, electronic engineering, information engineering information engineering telecommunications radio technology radio frequency
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering computer hardware computer processors
- engineering and technology mechanical engineering vehicle engineering
- engineering and technology nanotechnology nano-materials
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering computer hardware supercomputers
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-ICT-2007-1
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
92200 Courbevoie
France
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.