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MAGIC

Project reference: 214945
Funded under: FP7-ICT

MAsk less lithoGraphy for IC manufacturing (MAGIC) [Print to PDF] [Print to RTF]

From 2008-01-01 to 2010-12-31

Project details

Total cost:

EUR 16 694 010

EU contribution:

EUR 11 749 999

Coordinated in:

France

Call for proposal:

FP7-ICT-2007-1

Funding scheme:

CP - Collaborative project (generic)

MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.

In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool prices play also an important role in the overall cost of ownership of this technique. This trend opens opportunity for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developped by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron beam lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments.

This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focused on MAPPER and IMMS-NANO tools developments with the objective to deliver a first ML2 alpha platform compatible with 32 nm half pitch technology before 2010, aligned with the semiconductor manufacturer requirements. In relation with this activity, the program will develop the required infrastructure for the usage of this tools in an industrial environment. Among the tasks to be addressed, there is a delivery of a reliable software platform to treat the data base preparation and to provide solutions for ML2 related electron proximity effects. The last concern of this project will be to demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platform developpeed by the tool partners.

Objective

In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now the driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool price plays also an important role in the overall cost of ownership of this technique. This trend opens opportunities for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developed by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments...<br/>This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focused on MAPPER and IMS-NANO tool developments with the objective to deliver a first ML2 alpha platform compatible for 32nm half pitch technology before 2010, aligned with the semiconductor manufacturer requirements. In relation with this activity, the program will develop the required infrastructure for the usage of these tools in an industrial environment. Among the tasks to be addressed, there is the delivery of a reliable software platform to treat the data base preparation and to provide solution for ML2 related electron beam proximity effects. The last concern of this project will be to demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platforms developed by the tool partners.

Related information

Coordinator

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
France
Rue des Martyrs 17
Grenoble, France
Administrative contact: Marie-Laure Page
Tel.: +33 4 38 78 27 96
Fax: +33 4 38 78 51 83
E-mail

Participants

IMS NANOFABRICATION AG
Austria
SCHREYGASSE
WIEN, Austria
Administrative contact: Hans Loeschner
Tel.: +43 1 214 48 94 24
Fax: +43 1 214 48 94 99
E-mail
FACHHOCHSCHULE VORARLBERG GMBH
Austria
HOCHSCHULSTRASSE
DORNBIRN, Austria
Administrative contact: Johannes Edlinger
Tel.: +4355727927200
Fax: +4355727929501
E-mail
FUJIFILM ELECTRONIC MATERIALS (EUROPE) N. V.
Belgium
KEETBERGLAAN 1A, HAVENNUMMER 1061
ZWIJNDRECHT, Belgium
Administrative contact: EDDY CEELEN
Tel.: +32 3 2500537
Fax: +32 3 2530840
E-mail
DOW CORNING EUROPE SA
Belgium
Rue Jules Bordet Parc Industriel Zone C
SENEFFE, Belgium
Administrative contact: Gerard MARQUET
Tel.: +32 64 88 82 89
Fax: +32 64 88 84 81
E-mail
DELONG INSTRUMENTS AS
Czech Republic
PALACKEHO TR.
BRNO, Czech Republic
Administrative contact: Michal Drsticka
Tel.: +420 549123509
Fax: +420 541217976
E-mail
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Germany
Hansastrasse
MUENCHEN, Germany
Administrative contact: Walter KRAUSE
Tel.: +49 89 12 05 27 13
Fax: +49 89 12 05 75 34
E-mail
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
Germany
Wilschdorfer Landstrasse
Dresden, Germany
Administrative contact: Stephan Krueger
Tel.: +49 351 2774590
Fax: +49 351 27794590
E-mail
INSTITUT FUER MIKROELEKTRONIK STUTTGART
Germany
ALLMANDRING STRASSE
STUTTGART, Germany
Administrative contact: Manfred Salzmann
Tel.: +49 711 218 55 210
Fax: +49 711 218 55 7210
E-mail
ASELTA NANOGRAPHICS SA
France
PARVIS LOUIS NEEL
GRENOBLE, France
Administrative contact: Olivier PENY
Tel.: +33 6 08 67 23 11
E-mail
STMICROELECTRONICS CROLLES 2 SAS
France
RUE JEAN MONNET 850
CROLLES, France
Administrative contact: Guilaine BOSC
Tel.: +33 4 76 92 61 66
Fax: +33 4 76 92 58 71
E-mail
SYNOPSYS INTERNATIONAL LIMITED
Ireland
BLOCK 1 BLANCHARDSTOWN CORPORATE PARK
DUBLIN, Ireland
Administrative contact: Watchorn Charles
Tel.: +353 1 436 8861
Fax: +353 1 436 8862
E-mail
KLA-TENCOR CORPORATION (ISRAEL)
Israel
HATIKSHORET ST.
MIGDAL HAEMEK, Israel
Administrative contact: Adrien Davidson
Tel.: +972 4 6449443
Fax: +972 4 644 9450
E-mail
MAPPER LITHOGRAPHY B.V.
Netherlands
COMPUTERLAAN 15
DELFT, Netherlands
Administrative contact: Wim Hofland
Tel.: +31 15 888 02 53
Fax: +31 15 888 02 51
E-mail
Synopsys Armenia CJSC
Armenia
Arshakunyats
Yerevan, Armenia
Administrative contact: N/A N/A
Tel.: +00 0 000000
E-mail
SYNOPSYS SWITZERLAND LLC
Switzerland
Thurgauerstrasse
ZURICH, Switzerland
Administrative contact: N/A N/A
Tel.: +00 0 000000
E-mail
SYNOPSYS GMBH
Germany
KARL HAMMERSCHMIDT STR
ASCHHEIM, Germany
Administrative contact: N/A N/A
Tel.: +00 0 000000
E-mail
SYNOPSYS NETHERLANDS BV
Netherlands
St. Odgerusstraat 3
ROERMOND, Netherlands
Administrative contact: N/A N/A
Tel.: +00 0 000000
E-mail
Record Number: 85374 / Last updated on: 2014-10-14