Project description
Next-Generation Nanoelectronics Components and Electronics Integration
To develop a set of integrated EDA tools and modeling flows that combine the availability of accurate models for the new devices with a reliable system-level simulation for SiP design and verification
Today advanced System-in-Package(SiP) can integrate several Large-Scale-Integration(LSI) technologies and functionalities (advanced System-on-Chip-SoC),high-density memories,high-performance analogue-block.It's become strategic to analize and detect potential signal and power integrity failures before the prototype phase.The key to success is a set of integrated EDA tools and modelling flows that combine the availability of accurate models, either extracted by simulations or measurements, with reliable time-domain and system-level verification simulation methodologies.The aim is to develop reliable modelling and simulation solutions for SiP design and verification. The modelling activity will be related to measurement analysis for validating the simulation results and making available characterization measurement platforms.The research activities will be:1)Exploring innovative modelling approaches for Integrated-Circuit (IC) buffers, 3D physical structures and IC power rails beyond the current state-of-art;2)Investigating viable simulation and measurement strategies for SiP signal and power integrity analysis.The models and tools developed will be integrated in a unique EDA simulation platform and efforts will also be devoted to merge as more as possible the developed characterization measurement platforms.At the end of the project it is expected that the flows for extracting accurate simulation models will be available, together with a performing integrated EDA platform and a viable signal integrity measurement methodology. The final targets of project include:a)demonstration of the innovative IC simulation models developed and their related extraction flows by both simulation and measurement;b)the development of an innovative 3D EM field solver;c)the development of a performing SiP design and verification EDA platform;d)a demonstration of the developed signal integrity measurement techniques
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-ICT-2007-1
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Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
20864 AGRATE BRIANZA
Italy
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.