Cel The proliferation in the number of designs for ASICs, the increase in the number of functions per chip, and the decrease in the minimum feature size, necessitate faster turn-around times not only for IC prototypes, but also for mask fabrication tools. This, together with current demands and projections toward 0.3 micron minimum feature size, larger chips and higher placement accuracy, dictates the need for a new generation of tools for mask and reticle fabrication. The FREE project aimed at the development of a new electron-beam writing system for reticle fabrication that will answer the needs of the European IC industry for at least the next decade.The fast reticle equipment for Europe (FREE) project aimed at the development of a new electron beam writing system for reticle fabrication that will answer the needs of the European integrated circuit (IC) industry for at least the next decade. The target specifications of the system were a throughput of 2 reticles per hour, with a minimum feature size of 1.5 micron (5x reticle), and capable for writing small test structures down to 0.2 micron. It was to attain a placement accuracy of 70 nm (0.07 micron) for 6inch reticles and critical dimension (CD) tolerance of 50 nm (0.05 micron), both at 3 sigma. 2 beam-writing strategies were followed: beam shaping techniques (ELISA), in order to speed up the writing of large features, and a gaussian electron beam system (Leica Cambridge) with increased writing speed. Both basic systems already existed from the start, but required improvements in several areas. During the project the 2 machines were upgraded to achieve the writing objectives.A thermal field emitter source giving a higher brightness thant lanthanum boride and a 16 tungsten hairpin filament assembly with a long lifetime were designed and characterized. The design of a new column associated with high frequency detection (up to 25 MHz) was constructed and characterized. To achieve high throughput, the data rate handled by the pattern generator must be significantly improved. This was achieved by data compression techniques and higher electronic speeds for data transfer. Suitable designs were prepared in order to change the current batch loading strategy to a serial, single blank high speed handler that would be compatible with other reticle fabrication tools. Very high current densities are needed to achieve very high writing speeds. A very high sensitivity, short processing time and dry etch compatible resist has been synthesized and characterized.At the end of the project, evaluation of both the variable shaped and gaussian beam machine against the ultimatel y desired specifications were performed. Both machines showed significant improvement over the initial configurations, offering good prospects for the consolidation of a European system capable of competing in world markets. A comparison between them revealed their strong and weak points, and plans for further improvements were presented.The target specifications of the system were a throughput of two reticles per hour, with a minimum feature size of 1.5 micron (5x reticle), and be capable of writing small test structures down to 0.2 micron. It was to attain a placement accuracy of 70 nm (0.07 micron) for 6" reticles and critical dimension (CD) tolerance of 50 nm (0.05 micron), both at 3 sigma. Two beam-writing strategies were followed: beam-shaping techniques (ELISA), in order to speed up the writing of large features, and a gaussian electron beam system (Leica Cambridge) with increased writing speed. Both basic systems already existed from the start, but required improvements in several areas. Dziedzina nauki natural scienceschemical sciencesinorganic chemistrytransition metals Program(-y) FP2-ESPRIT 2 - European strategic programme (EEC) for research and development in information technologies (ESPRIT), 1987-1992 Temat(-y) Data not available Zaproszenie do składania wniosków Data not available System finansowania Data not available Koordynator EUROPEAN LITHOGRAPHY INNOVATION (ELISA) Wkład UE Brak danych Adres 1 PLACETTE DE LA MARJOLAINE 91440 BURES SUR YVETTE Francja Zobacz na mapie Koszt całkowity Brak danych Uczestnicy (6) Sortuj alfabetycznie Sortuj według wkładu UE Rozwiń wszystko Zwiń wszystko Cambridge Instruments Ltd Zjednoczone Królestwo Wkład UE Brak danych Adres Rustat Road CB1 3QH Cambridge Zobacz na mapie Koszt całkowity Brak danych NATIONAL RESEARCH CENTRE FOR SCIENTIFIC RESEARCH DEMOKRITOS Grecja Wkład UE Brak danych Adres AGHIA PARASKEVI, 60228 15310 ATHENES Zobacz na mapie Koszt całkowity Brak danych TECHNISCHE UNIVERSITEIT DELFT Niderlandy Wkład UE Brak danych Adres FELDMANNWEG 17, 5053 2600 GB DELFT Zobacz na mapie Koszt całkowity Brak danych Thomson Microelectronics Srl (SGS) Włochy Wkład UE Brak danych Adres Via Carlo Olivetti 20041 Agrate Brianza Milano Zobacz na mapie Koszt całkowity Brak danych UNIVERSITY OF CAMBRIDGE Zjednoczone Królestwo Wkład UE Brak danych Adres MADINGLEY ROAD CB3 0ES CAMBRIDGE Zobacz na mapie Koszt całkowity Brak danych Valvo Unternehmensbereich Niemcy Wkład UE Brak danych Adres Burchardstraße 19 20095 Hamburg Zobacz na mapie Koszt całkowity Brak danych
