Descrizione del progetto Flexible, organic and large area electronics Mostra l’obiettivo del progetto Nascondi l’obiettivo del progetto Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence allows realising a broad variety of disposable communicative packages. These packages provide increased interaction between the packed product, the package and the user through near-field communication systems, allowing improved intelligent control of the logistic process of high volume applications like medicine and food. The chosen demonstrator is a Smart Blister package, which monitors the medicine taking behaviour of patients to ensure therapy compliance. Therapy non-compliance is a severe ethical and economic problem, leading to considerable numbers of casualties per year and high health care cost.A breakthrough is needed to raise the throughput of ultra thin chip placement and interconnection while reducing the cost. Target values are: chip thickness 10-20µm, 10-50 chips/second, package thickness 30-50µm, and assembly cost reduction 50%.The proposed Chip2Foil technical concept combines two main elements: (1) self-assembly for high speed chip placement with moderate accuracy, and (2) an adaptive circuitry approach, which compensates the initial placement errors and creates electrical interconnects after the chips have been placed.The objectives of Chip2Foil are to develop the main technology building blocks for the self-assembly and the adaptive circuitry approach, to determine and evaluate a preferred integration of these techniques, and to demonstrate and evaluate a complete process flow by realising a communicative foil package for the Smart Blister application.The consortium of 7 partners (4 industrial of which 1 global end-user, 2 research centres, 1 university) are leading partners in the field of flexible electronics and chip integration.The duration is 36 months, the total cost is ~4.7M€, the EU contribution is ~3M€. Campo scientifico natural scienceschemical sciencespolymer sciences Programma(i) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Argomento(i) ICT-2009.3.3 - Flexible, organic and large area electronics Invito a presentare proposte FP7-ICT-2009-4 Vedi altri progetti per questo bando Meccanismo di finanziamento CP - Collaborative project (generic) Coordinatore TECHNISCHE UNIVERSITEIT DELFT Contributo UE € 542 265,00 Indirizzo STEVINWEG 1 2628 CN Delft Paesi Bassi Mostra sulla mappa Regione West-Nederland Zuid-Holland Delft en Westland Tipo di attività Higher or Secondary Education Establishments Contatto amministrativo Marcel Tichem (Dr.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato Partecipanti (7) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto PLASTIC ELECTRONIC GMBH Austria Contributo UE € 261 819,00 Indirizzo LUNZERSTRASSE 4030 LINZ Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Philip Weissel (Mr.) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato BESI AUSTRIA GMBH Austria Contributo UE € 300 640,00 Indirizzo INNSTRASSE 16 6240 Radfeld Mostra sulla mappa Regione Westösterreich Tirol Tiroler Unterland Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Elisabeth Silberberger (Ms.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Belgio Contributo UE € 651 450,00 Indirizzo KAPELDREEF 75 3001 Leuven Mostra sulla mappa Regione Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Tipo di attività Research Organisations Contatto amministrativo Christine Van Houtven (Ms.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato ORBOTECH LTD Israele Contributo UE € 579 569,00 Indirizzo . 81101 Yavne Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Solomon Benny (Mr.) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO Paesi Bassi Contributo UE € 485 826,00 Indirizzo ANNA VAN BUERENPLEIN 1 2595 DA Den Haag Mostra sulla mappa Regione West-Nederland Zuid-Holland Agglomeratie ’s-Gravenhage Tipo di attività Research Organisations Contatto amministrativo Jeroen van den Brand (Dr.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato QOLPAC BV Paesi Bassi Contributo UE € 152 920,00 Indirizzo RIGTERSBLEEK AALTEN 4 K102A 7500 RB ENSCHENDE Mostra sulla mappa Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Bjorn Janse (Mr.) Collegamenti Contatta l’organizzazione Opens in new window Costo totale Nessun dato Koninklijke DSM N.V. Partecipazione conclusa Paesi Bassi Contributo UE € 5 511,00 Indirizzo Het Overloon 1 6411 TE Heerlen Mostra sulla mappa Regione Zuid-Nederland Limburg (NL) Zuid-Limburg Tipo di attività Private for-profit entities (excluding Higher or Secondary Education Establishments) Contatto amministrativo Philip Hul (Dr.) Collegamenti Contatta l’organizzazione Opens in new window Sito web Opens in new window Costo totale Nessun dato