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BIANCHO

Project reference: 257974
Funded under: FP7-ICT

BIsmide And Nitride Components for High temperature Operation [Print to PDF] [Print to RTF]

From 2010-07-01 to 2014-07-31

Project details

Total cost:

EUR 2 876 450

EU contribution:

EUR 2 189 999

Coordinated in:

Ireland

Call for proposal:

FP7-ICT-2009-5

Funding scheme:

CP - Collaborative project (generic)

BIANCHO will develop photonic components designed to significantly reduce power consumption at the component and system level in advanced communication systems, thereby saving significant electricity, and enabling unlimited bandwidth through integration, more optical processing and very high spectral-density photonic transmission.

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Current telecomm components suffer severely from intrinsic losses. Around 80% of electrical power is wasted in a 1.55?m laser chip as heat. Most systems require thermo-electric coolers and an air-conditioned environment, further increasing the energy budget by over an order of magnitude. The losses are due to Auger recombination in semiconductor lasers and optical amplifiers (SOAs), and due to the temperature dependence of the energy gap in electro-absorption modulators (EAMs). Incremental approaches to overcome these problems have reached their limits.

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We propose a radical change, to manipulate the electronic band structure of novel dilute bismide and dilute nitride alloys of GaAs and InP to eliminate Auger recombination and dramatically reduce the temperature dependence of the energy gap. This allows us to research, develop, test and demonstrate uncooled EAMs, highly efficient uncooled lasers and SOAs. These properties are also highly beneficial for high speed photodiodes as required in transceivers, as will be demonstrated.BIANCHO brings together leading European groups with complementary expertise in epitaxy, device physics, band structure modelling and advanced design and fabrication, in a well focused consortium of exceptionally high quality. \\n

\\nThe project will strongly emphasise the protection of intellectual property and aggressive dissemination of results to maximize their impact. The team includes a key European component manufacturer (CIP), well connected to European and international network and system operators, providing a clear route to successful exploitation and commercialization of the technology. \\n

Objective

BIANCHO will develop photonic components designed to significantly reduce power consumption at the component and system level in advanced communication systems, thereby saving significant electricity, and enabling unlimited bandwidth through integration, more optical processing and very high spectral-density photonic transmission.<br/>Current telecomm components suffer severely from intrinsic losses. Around 80% of electrical power is wasted in a 1.55?m laser chip as heat. Most systems require thermo-electric coolers and an air-conditioned environment, further increasing the energy budget by over an order of magnitude. The losses are due to Auger recombination in semiconductor lasers and optical amplifiers (SOAs), and due to the temperature dependence of the energy gap in electro-absorption modulators (EAMs). Incremental approaches to overcome these problems have reached their limits. We propose a radical change, to manipulate the electronic band structure of novel dilute bismide and dilute nitride alloys of GaAs and InP to eliminate Auger recombination and dramatically reduce the temperature dependence of the energy gap. This allows us to research, develop, test and demonstrate uncooled EAMs, highly efficient uncooled lasers and SOAs. These properties are also highly beneficial for high speed photodiodes as required in transceivers, as will be demonstrated.<br/>BIANCHO brings together leading European groups with complementary expertise in epitaxy, device physics, band structure modelling and advanced design and fabrication, in a well focused consortium of exceptionally high quality. The project will strongly emphasise the protection of intellectual property and aggressive dissemination of results to maximize their impact. The team includes a key European component manufacturer (CIP), well connected to European and international network and system operators, providing a clear route to successful exploitation and commercialization of the technology.

Related information

Coordinator contact

Eoin O'REILLY
Tel.: +353 21 4904413
Fax: +353 21 4904402
E-mail

Coordinator

UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland
Lee Maltings
Cork, Ireland
Administrative contact: Conor Delaney
Tel.: +353 21 4904263
Fax: +353 21 4904058
E-mail

Participants

PHILIPPS UNIVERSITAET MARBURG
Germany
Biegenstrasse
MARBURG, Germany
Administrative contact: Christian Veldman
Tel.: +49 6421 2826022
Fax: +49 6421 2826382
E-mail
VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECHNOLOGIJOS MOKSLU CENTRAS
Lithuania
Savanoriu
VILNIUS, Lithuania
Administrative contact: Jolanta Juodiene
Tel.: +370 5 2661 640
Fax: +370 5 2627123
E-mail
THE CENTRE FOR INTEGRATED PHOTONICS LIMITED
United Kingdom
B55 ADASTRAL PARK, MARTLESHAM HEATH
IPSWICH, SUFFOLK, United Kingdom
Administrative contact: Leigh Hepplethwaite
Tel.: +44 1473663111
Fax: +44 1473663295
E-mail
UNIVERSITY OF SURREY
United Kingdom
Stag Hill
GUILDFORD, United Kingdom
Administrative contact: SUE ANGULATTA
Tel.: +44 1483 682687
Fax: +44 1483 689567
E-mail
Record Number: 95040 / Last updated on: 2015-03-27