Community Research and Development Information Service - CORDIS

FP7 Semiconductor Equipment Assessment

SEAL

Project reference: 257379
Funded under

Semiconductor Equipment Assessment Leveraging Innovation

From 2010-06-01 to 2013-09-30

Project details

Total cost:

EUR 14 059 075

EU contribution:

EUR 9 099 955

Coordinated in:

Germany

Call for proposal:

FP7-ICT-2009-5See other projects for this call

Funding scheme:

CP - Collaborative project (generic)

Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.

SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects. For Lithography, the key areas of illumination systems for mask aligners, EUV mask manufacturing and intelligent overlay management are addressed as well as massively parallel e-beam lithography. In addition, three important processes are addressed: low temperature oxidation, cleaning of sensitive interconnect stacks/structures and ion implantation for ultra shallow junctions and defect engineering. For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilised with specifications that will be refined for each equipment type for the progressively emerging technology nodes.Overall, SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.

Objective

SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects.For Lithography, the key areas of illumination systems for mask aligners, EUV mask manufacturing and intelligent overlay management are addressed as well as massively parallel e-beam lithography. In addition, three important processes are addressed: low temperature oxidation, cleaning of sensitive interconnect stacks/structures and ion implantation for ultra shallow junctions and defect engineering. For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilised with specifications that will be refined for each equipment type for the progressively emerging technology nodes.Overall, SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.

Related information

Coordinator contact

Lothar Pfizner
E-mail
Lothar Pfizner
E-mail
Lothar Pfizner
E-mail
Lothar Pfizner
E-mail
Lothar Pfizner
E-mail
Lothar Pfizner
E-mail

Coordinator

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Germany

EU contribution: EUR 2 404 635


Hansastrasse 27C
80686 MUENCHEN
Germany
Administrative contact: Andrea Zeumann
Tel.: +49 89 12052327
Fax: +49 89 1205772723
E-mail

Participants

LAM RESEARCH AG
Participation ended
Austria

EU contribution: EUR 0


SEZ-STRASSE 1
9500 VILLACH
Austria
Administrative contact: Harald Kraus
Tel.: +43 4242 204 924
Fax: +43 4242 204 924
E-mail
AMS AG
Austria

EU contribution: EUR 38 875


TOBELBADERSTRASSE
8141 UNTERPREMSTAETTEN
Austria
Administrative contact: Yasmine Pree
Tel.: +4331365005474
E-mail
FACHHOCHSCHULE WIENER NEUSTADT FUR WIRTSCHAFT UND TECHNIK GMBH
Austria

EU contribution: EUR 50 128


JOHANNES GUTENBERGSTRASSE
2700 WIENER NEUSTADT
Austria
Administrative contact: Helmut Pfeffer
Tel.: +43262289084116
Fax: +43262289084141
E-mail
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium

EU contribution: EUR 1 260 031


Kapeldreef
3001 LEUVEN
Belgium
Administrative contact: Christine Van Houtven
Tel.: +3216281613
Fax: +3216281812
E-mail
SUSS MICROOPTICS SA
Switzerland

EU contribution: EUR 145 232


RUE JAQUET DROZ
2007 NEUCHATEL
Switzerland
Administrative contact: Kristina Schulz
Tel.: +41327205104
Fax: +41327205713
E-mail
Reinhardt Microtech AG
Switzerland

EU contribution: EUR 68 078


Aeulistrasse
CH - 7323 Wangs
Switzerland
Administrative contact: Wolfgang Tschanun
Tel.: +41 817200456
Fax: +41 81 720 04 50
E-mail
SUSS MicroTec Lithography GmbH
Germany

EU contribution: EUR 180 533


SCHLEISSHEIMER STRASSE
85748 GARCHING
Germany
Administrative contact: Susanne Mölter
Tel.: +49 89 32007109
Fax: +49 89 32007162
E-mail
ICT Integrated Circuit Testing GmbH
Germany

EU contribution: EUR 108 000


Ammerthalstrasse
85551 Heimstetten
Germany
Administrative contact: Marc Gurman
Tel.: +498990999467
Fax: +498990999429
E-mail
Landshut Silicon Foundry GmbH
Participation ended
Germany

EU contribution: EUR 31 800


Jenaerstrasse
84034 Landshut
Germany
Administrative contact: Elke Heilmeier
Tel.: +498716840
Fax: +49871684150
E-mail
NANDA TECHNOLOGIES GMBH
Germany

EU contribution: EUR 376 100


Lise-Meitner-Strasse
85716 Unterschleissheim
Germany
Administrative contact: Johannes von Borries
Tel.: +49 89 4523558 21
Fax: +49 89 4523558 70
E-mail
SUSS MicroTec Photomask Equipment GmbH & Co. KG
Germany

EU contribution: EUR 49 352


Ferdinand-von-Steinbeis-Ring
75447 Sternenfels
Germany
Administrative contact: Peter Dreß
Tel.: +49704541235
Fax: +49704541239
E-mail
ACP - ADVANCED CLEAN PRODUCTION GMBH
Germany

EU contribution: EUR 123 000


RONTGENSTRASSE
73730 ESSLINGEN
Germany
Administrative contact: Josef Gentischer
Tel.: +49715179068
E-mail
SUSS MICROTEC AG
Participation ended
Germany

EU contribution: EUR 0


SCHLEISSHEIMERSTRASSE
85748 GARCHING
Germany
Administrative contact: Markus Gabriel
Tel.: +49 8932007339
Fax: +49 89 32007162
E-mail
INFINEON TECHNOLOGIES AG
Germany

EU contribution: EUR 274 985


Am Campeon 1-12
85579 Neubiberg
Germany
Administrative contact: Bernhard Scholz
Tel.: +49 89 234 22339
Fax: +49 89 234 955 0395
E-mail
SILTRONIC AG
Germany

EU contribution: EUR 103 516


HANNS-SIEDEL-PLATZ
81737 MUENCHEN
Germany
Administrative contact: Thomas Renner
Tel.: +498985643230
Fax: +498985643239
E-mail
Fries Research & Technology GmbH
Germany

EU contribution: EUR 89 660


Friedrich-Ebert-Straße
51429 Bergisch Gladbach
Germany
Administrative contact: Thomas Fries
Tel.: +492204842430
Fax: +492204842431
E-mail
Oxford Instruments GmbH
Germany

EU contribution: EUR 49 733


Otto-von-Guericke Ring
65205 Wiesbaden
Germany
Administrative contact: Rune Gehrlein
Tel.: +496122937156
Fax: +496122937178
E-mail
Jenoptik Automatisierungstechnik GmbH
Germany

EU contribution: EUR 81 412


Konrad-Zuse-Strasse
07745 Jena
Germany
Administrative contact: Hans-Ulrich Zuehlke
Tel.: +49 3641 653890
Fax: +49 3641 65 13 3890
E-mail
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
Germany

EU contribution: EUR 114 420


Wilschdorfer Landstrasse
01109 Dresden
Germany
Administrative contact: Petra Hetzer
Tel.: +49 351 2774514
Fax: +49 351 277 9 4514
E-mail
HQ-Dielectrics GmbH
Germany

EU contribution: EUR 361 400


Dornstadter Weg
89160 Dornstadt
Germany
Administrative contact: Alexander Gschwandtner
Tel.: +491728338658
Fax: +497348204928
E-mail
PVA TEPLA ANALYTICAL SYSTEMS GMBH
Germany

EU contribution: EUR 405 758


Gartenstrasse
73430 Aalen
Germany
Administrative contact: Peter Czurratis
Tel.: +4973613765230
Fax: +49736137652313
E-mail
Protec Carrier Systems GmbH
Germany

EU contribution: EUR 149 999


Birlenbacher Strasse
57078 Siegen
Germany
Administrative contact: Sebastian Wagner
Tel.: +49 271 8904116
Fax: +49 271 8904119
E-mail
FUNDACIO PRIVADA INSTITUT CATALA DE NANOTECNOLOGIA
Spain

EU contribution: EUR 50 555


CAMPUS DE LA UAB EDIFICI CM7
08193 BELLATERRA (BARCELONA)
Spain
Administrative contact: Stella Veciana
Tel.: +34 935813840
Fax: +34 935814747
E-mail
ION BEAM SERVICES
France

EU contribution: EUR 215 986


RUE GASTON IMBERT PROLONGEE
13790 ROUSSET
France
Administrative contact: Frank TORREGROSA
Tel.: +33 4 42 53 89 64
Fax: +33 4 42 53 89 59
E-mail
TOPPAN PHOTOMASKS FRANCE SAS
France

EU contribution: EUR 85 437


ROUSSET PARC CLUB, AVENUE FRANCIS PERRIN
13106 ROUSSET
France
Administrative contact: MICHEL TISSIER
Tel.: +33674648580
Fax: +3342290493
E-mail
ADIXEN VACUUM PRODUCTS SAS
France

EU contribution: EUR 132 224


AVENUE DE BROGNY
74009 ANNECY
France
Administrative contact: JACQUES DE SAINT TRIVIER
Tel.: +33 4 50657949
Fax: +33 4 50465065
E-mail
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES SA
Participation ended
France

EU contribution: EUR 0


CHEMIN DES FRANQUES - PARC TECHNOLOGIQUE DES FONTAINES
38190 BERNIN
France
Administrative contact: Robert Langer
Tel.: +33 4 76 92 95 88
Fax: +33 4 76 92 9761
E-mail
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
France

EU contribution: EUR 863 267


RUE LEBLANC
75015 PARIS 15
France
Administrative contact: Marie-Laure Page
Tel.: +33 4 38782796
Fax: +33 4 38785183
E-mail
STMICROELECTRONICS CROLLES 2 SAS
France

EU contribution: EUR 202 401


RUE JEAN MONNET 850
38920 CROLLES
France
Administrative contact: Dominique Goubier
Tel.: +33 4 38 92 34 11
Fax: +00 0 000000 00 00
E-mail
SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG
Hungary

EU contribution: EUR 93 250


PRIELLE KORNELIA UTCA
1117 BUDAPEST
Hungary
Administrative contact: Anita Farkasinszki
Tel.: +36 1 382 4530
Fax: +36 1 382 4532
E-mail
KLA-TENCOR CORPORATION (ISRAEL)
Israel

EU contribution: EUR 85 625


HATIKSHORET ST.
23100 MIGDAL HAEMEK
Israel
Administrative contact: Daniel Kandel
Tel.: +972 46449449
Fax: +972 46449450
E-mail
APPLIED MATERIALS ISRAEL LTD
Israel

EU contribution: EUR 413 000


OPPENHEIMER
76705 REHOVOT
Israel
Administrative contact: Yoram Uziel
Tel.: +97289499915
Fax: +97289486269
E-mail
MICRON SEMICONDUCTOR ITALIA SRL
Italy

EU contribution: EUR 55 720


VIA CAMILLO OLIVETTI
20864 AGRATE BRIANZA
Italy
Administrative contact: MANUELA SEMINARA
Tel.: +39 039 603 6669
Fax: +39 039 603 2777
E-mail
MEMC ELECTRONIC MATERIALS SPA
Italy

EU contribution: EUR 22 500


VIALE GHERZI
28100 NOVARA
Italy
Administrative contact: Fabrizio Viker
Tel.: +390321334471
Fax: +390321691000
E-mail
MAPPER LITHOGRAPHY B.V.
Netherlands

EU contribution: EUR 81 675


COMPUTERLAAN 15
2628 XK DELFT
Netherlands
Administrative contact: Bert Jan Kampherbeek
Tel.: +31158880262
Fax: +31158880262
E-mail
Metryx Ltd
United Kingdom

EU contribution: EUR 331 668


Unit 2 A, MANOR PARK, Nailsea Wall Lane
BS48 4DD Nailsea
United Kingdom
Administrative contact: Mark Berry
Tel.: +441275859988
Fax: +441275866112
E-mail
Intel Corporation
United States

EU contribution: EUR 0


ORANGE STREET
19801 WILMINGTON NEW CASTLE DE
United States
Administrative contact: Gilroy Vandentop
Tel.: +1 971 214 3331
Fax: +1 503 613 7997
E-mail
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
United States

EU contribution: EUR 0


STATE STREET
12201 ALBANY NY
United States
Administrative contact: Michael Liehr
Tel.: +1 518 441 7816
Fax: +1 518 441 7816
E-mail
Record Number: 95776 / Last updated on: 2016-04-11