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Content archived on 2024-05-28

Advanced Surface Protection for Improved Reliability PCB Systems

Objective

To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.

Call for proposal

FP7-SME-2008-2
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Coordinator

THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
EU contribution
€ 447 167,00
Address
Forestfield 25
TD5 7BX KELSO
United Kingdom

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Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Martin Trevor Goosey (Dr.)
Links
Total cost
No data

Participants (10)