Objective
To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.
Fields of science
Call for proposal
FP7-SME-2008-2
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Funding Scheme
BSG-SME-AG - Research for SME associations/groupingsCoordinator
TD5 7BX KELSO
United Kingdom
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Participants (10)
AL2 2DD St Albans
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6211 ND MAASTRICHT
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2595 DA Den Haag
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02300 Vilnius
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LE1 7RH Leicester
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10553 Berlin
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BN3 3ND Hove
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EX17 1HN CREDITON
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5704 GV HELMOND
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20123 Milano
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