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SMARTPOWER

Project ID: 288801
Financé au titre de

Smart integration of GaN & SiC high power electronics for industrial and RF applications

De 2011-09-01 à 2016-01-31, projet clôturé

Détails concernant le projet

Coût total:

EUR 7 410 112

Contribution de l'UE:

EUR 5 075 000

Coordonné à/au(x)/en:

France

Appel à propositions:

FP7-ICT-2011-7See other projects for this call

Régime de financement:

CP - Collaborative project (generic)

Description

Packaging and thermal management in an efficient and cost effective way for SiC and GaN-based power devices

For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom radio frequency applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of the SMARTPOWER project is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules into industrial power inverters and RF transmitters systems, respectively. This main objective is supported in the project by two routes of research. The first one of them is the developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules and integrated temperature sensor. The second one is the development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner. The RTD developments will be demonstrated into the realisation of two high power modules: a SiC-based inverter for UPS, solar and motor-drive applications as well as a GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.

Objectif

For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom RF applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of SMARTPOWER is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules respectively into industrial power inverters and RF transmitters systems. This main objective is supported in the project by two routes of research:- The developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules andintegrated temperature sensor.- The development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner.The RTD developments will be demonstrated into the realisation of two high power modules: (i) SiC-based inverter for UPS, solar and motor-drive applications (ii) GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives. It is well balanced and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.

Coordinateur

THALES SA
France

Contribution de l'UE: EUR 939 460


TOUR CARPE DIEM PLACE DES COROLLES ESPLANADE NORD
92200 COURBEVOIE
France
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Afshin Ziaei
Tél.: +33169415777
Fax: +33169415538

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Participants

TAIPRO ENGINEERING SA
Belgium

Contribution de l'UE: EUR 362 110


RUE DES CHASSEURS ARDENNAIS 4
4031 LIEGE (ANGLEUR)
Belgium
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Michel Saint-Mard
Tél.: +32 4 382 44 94

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TECHNISCHE UNIVERSITAET CHEMNITZ
Germany

Contribution de l'UE: EUR 284 400


STRASSE DER NATIONEN 62
09111 CHEMNITZ
Germany
Activity type: Higher or Secondary Education Establishments
Contact administratif: Annett Kempe
Tél.: +49 371 531 12310
Fax: +49 371 531 12319

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FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany

Contribution de l'UE: EUR 625 744


HANSASTRASSE 27C
80686 MUNCHEN
Germany
Activity type: Research Organisations
Contact administratif: Christoph Schulte
Tél.: +49 89 1205 2728
Fax: +49 89 1205 7534

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INFINEON TECHNOLOGIES AG
Germany

Contribution de l'UE: EUR 284 937


AM CAMPEON 1-12
85579 NEUBIBERG
Germany
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Mingxia Wu-Lutzenberger
Tél.: +498923420713

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BERLINER NANOTEST UND DESIGN GMBH
Germany

Contribution de l'UE: EUR 91 800


VOLMERSTRASSE 9 B
12489 BERLIN
Germany
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Thomas Winkler
Tél.: +493063923880
Fax: +493063923881

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Micropelt GmbH
Germany

Contribution de l'UE: EUR 186 247


EMMY-NOETHER-STRASSE 2
79110 FREIBURG
Germany
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Oliver Keilhack
Tél.: +49 761 156 33772

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THALES SYSTEMES AEROPORTES SAS
France

Contribution de l'UE: EUR 218 168


AV GAY LUSSAC LA CLEF DE SAINT PIERRE 2
78990 ELANCOURT
France
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Jean-Michel BESNIER
Tél.: +33 1 34813875
Fax: +33 1 34815900

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COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
France

Contribution de l'UE: EUR 568 946


RUE LEBLANC 25
75015 PARIS 15
France
Activity type: Research Organisations
Contact administratif: Stephanie THOLLON
Tél.: +33 4 3878 9732
Fax: +33 4 3878 5132

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SCHNEIDER ELECTRIC INDUSTRIES SAS
France

Contribution de l'UE: EUR 193 381


RUE JOSEPH MONIER 35
92500 RUEIL MALMAISON
France
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Sylvain Paineau
Tél.: +33 4 76 57 60 47
Fax: +33 4 76 57 32 32

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FOUNDATION FOR RESEARCH AND TECHNOLOGY HELLAS
Greece

Contribution de l'UE: EUR 267 975


N PLASTIRA STR 100
70013 HERAKLION
Greece
Activity type: Research Organisations
Contact administratif: Zinovia Papatheodorou
Tél.: +302810391522
Fax: +302810391555

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BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM
Hungary

Contribution de l'UE: EUR 260 898


MUEGYETEM RAKPART 3
1111 BUDAPEST
Hungary
Activity type: Higher or Secondary Education Establishments
Contact administratif: Márta Rencz
Tél.: +36 1 4632727
Fax: +36 1 4632973

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INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE
Romania

Contribution de l'UE: EUR 184 356


EROU IANCU NICOLAE STREET 32B
077190 VOLUNTARI
Romania
Activity type: Research Organisations
Contact administratif: DOMNICA GEAMBAZI
Tél.: +40 21 269 07 70
Fax: +40 21 269 07 72

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CHALMERS TEKNISKA HOEGSKOLA AB
Sweden

Contribution de l'UE: EUR 331 440


-
41296 GOETEBORG
Sweden
Activity type: Higher or Secondary Education Establishments
Contact administratif: Johan Liu
Tél.: +46 31 772 3067

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SHT SMART HIGH-TECH AB
Sweden

Contribution de l'UE: EUR 275 138


FYSIKGRAND 3
412 96 GOTEBORG
Sweden
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contact administratif: Lilei Ye
Tél.: +46769489996

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