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Frequency-agile lasers for photonic sensing

Project description

Scalable and high-performance platform transforms laser landscape

In the world of lasers, precision has always come at a cost. Since the invention of the laser, manufacturing methods often still rely on manual assembly, hindering advancements. Despite the ubiquity of lasers in communication, sensing, and quantum technology, manufacturing principles are still partially archaic, relying on hand-assembled bulk components or optical fibres. In this context, the EIC-funded FORTE project will leverage recent breakthroughs in low-loss integrated photonics to revolutionise laser production and introduce a new era of cost-effective wafer-scale testing and automated manufacturing with unparalleled performance. The results will be benchmarked in applications targeting markets such as structural health monitoring, sensing for automatic driving or future 6G networks. Furthermore, a start-up will commercialise integrated frequency agile low-noise lasers.

Objective

Lasers are a ubiquitous technology in optical communication, sensors, LiDAR or emerging quantum science and technology. Yet, the principles by which lasers are manufactured have remarkably not changed since the invention of the laser: they are assembled by hand, using bulk components or optical fibers. While integrated lasers based on silicon photonics exist, they do not challenge such high performance legacy lasers systems. FORTE will change this notion. Building on a recent breakthrough in the field of low loss integrated photonics it is today possible to create lasers that are low cost, wafer scale manufacturable that have better performance that the fiber laser the workhorse of fiber sensing and gold standard in coherence. The overarching ambition of this EIC transition project is to develop a prototype and mature photonic integrated circuit-based frequency-agile ultra-low noise laser technology, and apply it to the domain of fiber sensing and FMCW LiDAR, and to develop a scalable manufacturing. The unique selling points (USP) of the platform are that it is based on photonic integrated circuit technology that is scalable, flexible, reconfigurable, and extremely high performance in terms of optical coherence and frequency-agility. The technology is based on a patented approach that combines ultra-low loss photonic integrated circuits based on silicon nitride, with MEMS technology, as used in wireless technology. The approach addresses the need for low-noise laser sources in multiple domains of photonic sensing including distributed fiber optic sensing (DFOS) and coherent laser ranging (FMCW LiDAR). The consortium includes companies in fiber sensing, LiDAR as well as in the development of industrial manufacturing tools. The results will be commercialized by the involvement of SME in fiber sensing, and a dedicated startup to bring hybrid integrated frequency agile low noise lasers to the market.

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Topic(s)

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HORIZON-EIC - HORIZON EIC Grants

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Call for proposal

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(opens in new window) HORIZON-EIC-2023-TRANSITION-01

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Coordinator

THALES
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 828 093,75
Address
4 RUE DE LA VERRERIE
92190 MEUDON
France

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Region
Ile-de-France Ile-de-France Hauts-de-Seine
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 828 093,75

Participants (2)

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