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Adaptive microcombs for innovative connectivity in datacenter applications and optical clocks

Project description

New microcomb technology to boost data centre efficiency

As data traffic continues to surge, data centres face increasing pressure to enhance their interconnect architecture. Co-packaged optics (CPO) hold great potential for achieving this, boosting computational efficiency by integrating optoelectronic modules close to each other. This technology is expected to see significant market growth, but it requires multi-wavelength laser sources for meeting future bandwidth needs. Funded by the European Innovation Council, the AMICA project plans to build upon wafer-scalable, efficient microcomb technology to develop key demonstrators in wavelength division multiplexing CPO. Researchers will target petabit-per-second data transfer speeds on a scalable platform, offering an unprecedented combination of channel count, efficiency, line spacing, and power per channel.

Objective

The rampant growth of ICT applications, such as AI, is moving an increasing amount of computing resources to datacentres. Datacentres are responsible for approximately three quarters of the internet protocol data in the world. The continuous increase in data traffic and bandwidth demands are challenging the status quo of the datacentre interconnect architecture. The outstanding challenge for the next decade is finding scalable and efficient solutions to enable the bandwidth density that will be needed.
Co-packaged optics (CPO) is the enabling technology to drive this shift in the computational efficiency paradigm, and the market in silicon photonics with largest forecasted CAGR in 2022-2026, with potential multi-billion dollar revenues beyond 2030. CPO is based on decreasing the distance of power-hungry electrical interfaces by co-integrating optoelectronic modules on the same interposers.
In order to drive the scaling in optical edge bandwidth density, multi-wavelength laser sources for densed wavelength division multiplexing will be needed, but state of the art commercial solutions face fundamental scaling issues.
Amica builds upon a breakthrough wafer-scalable, super-efficient microcomb technology to realize critical demonstrators in WDM CPO, aiming at petabit-per-second aggregate speeds in a mass-manufacturable platform with unprecedented combination of channel count, efficiency, line spacing and power per line. The consortium brings a synergetic effort among an industrial leader in datacentre interconnects and high-performance computing, academic partners with complementary expertise in integrated photonics and an emerging startup that owns the intellectual property rights for commercialization. The team is complemented with an innovation office to lead the tech to market transition, and two associated partners who will help testing the technology for emerging markets beyond telecom.

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Topic(s)

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HORIZON-EIC - HORIZON EIC Grants

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Call for proposal

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(opens in new window) HORIZON-EIC-2023-TRANSITION-01

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Coordinator

CHALMERS TEKNISKA HOGSKOLA AB
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 240 590,00
Address
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412 96 Goteborg
Sweden

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Region
Södra Sverige Västsverige Västra Götalands län
Activity type
Higher or Secondary Education Establishments
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 240 590,00

Participants (4)

Partners (2)

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