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Programmable interfaces: towards reliable and recyclable composite materials via debonding on demand

Project description

Rethinking material interfaces for sustainability

Engineering components often rely on combining different materials, such as metal films on polymers, which are essential in food packaging, satellite insulation, and flexible displays. However, the interfaces between these layers are weak links prone to failure due to mismatched properties. Enhancing adhesion can improve durability but hampers recyclability, a critical sustainability challenge. In this context, the ERC-funded InterBond project aims to revolutionise interface design with ‘programmable interfaces’ that ensure strong adhesion during use but allow controlled debonding when necessary. By integrating triggers like metallic nanoparticles for targeted delamination, the project pioneers nanoscale innovations for sustainable thin-film composites. This research could transform polymer-metal composites into recyclable, high-performance materials for diverse technical applications.

Objective

The combination of different materials is often key to the functionality of engineering components. For instance, metal films on polymers are omnipresent composite materials, from food packaging to satellite insulation and flexible electronic displays. Thereby, interfaces are often the weakest link, associated with dissimilar physical properties of adjacent layers or joining parts. A common strategy to prevent interface failure is enhancing adhesion. However, strong (inseparable) interfaces limit recyclability, an aspect largely neglected yet. Novel interface design could change this situation. This proposal outlines a research program to establish new scientific principles for the nanoscale design of innovative “programmable interfaces” with reliable adhesion in use and thereafter “debonding upon request”, aiming at a new generation of reliable and recyclable sustainable thin film composite devices.
Recent work of the PI on naturally well-adhering Al on Polyimide (adhesion energy Γ=40 Jm-2) suggests how unique benefits can be mimicked artificially for weak systems (2 Jm-2) via molecular layers (Al-O-C Alucones) deposited at the interface. The PI hypothesizes that inseparability of metallization and substrate can be solved by incorporated “triggers” for controlled degradation and delamination in conditions beyond those of standard use, e.g. via local heating at the interface by optical excitation of metallic nanoparticles.
”InterBond” shall combine a) fabrication of inorganic-organic model interfaces with triggerable degradation mechanisms, b) in-situ testing of interface strength in service/trigger conditions and c) physical modelling of structural integrity as a function of material combination and architectural design. This research program will focus on interfaces in metal films on polymer, yet the outcomes should apply to lightweight polymer matrix composites with metallic or ceramic fillers, leading the path to sustainable materials for technical applications.

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Call for proposal

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(opens in new window) ERC-2024-STG

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Host institution

MONTANUNIVERSITAET LEOBEN
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 1 499 972,50
Address
FRANZ JOSEF STRASSE 18
8700 LEOBEN
Austria

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Region
Südösterreich Steiermark Östliche Obersteiermark
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 1 499 972,50

Beneficiaries (1)

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