Project description
New technology to spur production of integrated chips
Advanced technologies will make sure the Telecom sector continues to grow. The role of photonic integrated circuits (PICs) and indium phosphide (InP) will be instrumental to drive expansion but it is made only by a few enterprises. Due to this, the vast sector of data and sensor technology is deprived of the superior functionality these offer. Smart Photonics has developed a sequence of leading functional photonic modules that can be used as 'building blocks' to allow the creation of PICs. The EU-funded SmartPhotonics project will facilitate the industrialisation of software to allow customers to design chips with custom functionalities and numerous applications.
Objective
The Telecom sector is predicted to explode over the next few years, driven by data from IoT sensing solutions, games, autonomous driving, gaming and AI-technologies. Photonic Integrated Circuits (PICs) on Indium Phosphide (InP) will play a critical role in providing the superior functionality demanded. Today. only few companies can produce integrated chips but do so exclusively for their own vertically integrated production lines, making it impossible for many thousands of other companies in sensor and data technology to tap into this technology.
SMART Photonics has developed a suite of world class functional photonic modules based on InP, which can be combined together as “building blocks”. It simplifies the design of photonic circuits and allows SMART complete flexibility to quickly build up functional PICs to meet any given application.
SMART has calculated its specific obtainable market in the data&telecom and sensing markets of €350m by 2021 and €1.16bn by 2023 respectively.
Two first customers are ready to enter volume manufacturing in 2019/2020. By 2023, SMART plans €210m revenues at a gross margin of 70% and employ 120 staff.
The Phase 2 project will help industrialize the manufacturing processes and prepare for scale-up. The project is strategic to the company as it will develop the processes needed for reliable volume production, set-up a pilot line (1.000 wafers/year) and develop a Process Design Kit – a software tool – that will empower customers to design chips with custom functionality based on SMART’s technology platform.
At the end of Phase 2 SMART will:
• be positioned as the only independent foundry for InP PICs.
• have achieved readiness necessary build a commercial scale facility at 20,000 wafers/year
• have new building block capabilities allowing new applications in new, yet untargeted, markets
SMART is run by an experienced team with deep technical and commercial semiconductor and photonics backgrounds.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology mechanical engineering manufacturing engineering
- natural sciences computer and information sciences internet internet of things
- natural sciences chemical sciences inorganic chemistry post-transition metals
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
- natural sciences physical sciences electromagnetism and electronics semiconductivity
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.2.3. - INDUSTRIAL LEADERSHIP - Innovation In SMEs
MAIN PROGRAMME
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H2020-EU.3. - PRIORITY 'Societal challenges
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H2020-EU.2.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
SME-2 - SME instrument phase 2
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-EIC-SMEInst-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
5656 AE EINDHOVEN
Netherlands
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.