Results 1 - 10 of 56
ID: 318144
Start date: 2012-10-01, End date: 2016-03-31
The microelectronics industry will face major challenges related to power dissipation and energy consumption in the next years. Both static and dynamic consumption will soon start to limit microprocessor performance growth. The goal of the spOt project is to modify the memory...
Programme: FP7-ICT
Record Number: 105014
Last updated on: 2017-04-22
[PROJECT] CATHERINE - Carbon nAnotube Technology for High-speed nExt-geneRation nano-InterconNEcts
ID: 216215
Start date: 2008-01-01, End date: 2010-12-31
CATHERINE will provide a new unconventional concept for local and chip-level interconnects that will bridge ICT beyond the limits of CMOS technology.
The main goals of CATHERINE are:
G1) to develop an innovative cost-effective and reliable technological solution for h...
The main goals of CATHERINE are:
G1) to develop an innovative cost-effective and reliable technological solution for h...
Programme: FP7-ICT
Record Number: 85477
Last updated on: 2017-04-13
[PROJECT] S-PULSE - Shrink-Path of Ultra-Low Power Superconducting Electronics
ID: 215297
Start date: 2008-01-01, End date: 2010-06-30
The proposed Support Action S-PULSE aims to prepare Superconducting Electronics (SE) for the technology generation beyond the CMOS scaling limits ("beyond CMOS"). Scaling laws in CMOS technology indicate that some concepts cannot be simply extrapolated, and new physical effec...
Programme: FP7-ICT
Record Number: 85406
Last updated on: 2017-04-12
[PROJECT] NANOPACK - Nano Packaging Technology for Interconnect and Heat Dissipation
ID: 216176
Start date: 2007-11-01, End date: 2011-09-30
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integratio...
Programme: FP7-ICT
Record Number: 85245
Last updated on: 2017-04-19
[PROJECT] NANO RF - CARBON BASED SMART SYSTEMS FOR WIRELESS APPLICATIONS
ID: 318352
Start date: 2012-09-01, End date: 2016-06-30
From the strategic agendas of ENIAC,EPoSS and ITRS it is evident that wirelessapplications are gaining more and more importance that results to new requirements in terms of miniaturization and increased complexity.The limitations of Moore's Law in term of physics but also in ...
Programme: FP7-ICT
Record Number: 104973
Last updated on: 2017-04-25
[PROJECT] GRADE - Graphene-based Devices and Circuits for RF Applications
ID: 317839
Start date: 2012-10-01, End date: 2016-03-31
GRADE is a three-year STREP proposal focused on advanced RTD activities necessary to demonstrate the proof-of-concept of novel graphene-based electronic devices operating at terahertz (THz) frequencies. We propose two different concepts with specific advantages. Graphene fiel...
Programme: FP7-ICT
Record Number: 105140
Last updated on: 2017-04-22
[PROJECT] ENABLE450 - Coordination Action to enable an effective European 450 mm Equipment & Materials Network
ID: 318531
Start date: 2012-11-01, End date: 2016-10-31
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently orderi...
Programme: FP7-ICT
Record Number: 106496
Last updated on: 2017-04-25
[PROJECT] EUROSOI+ - European platform for low-power applications on Silicon-on-Insulator Technology
ID: 216373
Start date: 2008-01-01, End date: 2011-06-30
In the framework of FP6, the European Commission supported the formation of a European Network on Silicon on Insulator Technology, Devices and Circuits, whose main goal was to create a discussion forum for the exchange of ideas and results on the topic of Silicon-On-Insulator...
Programme: FP7-ICT
Record Number: 85479
Last updated on: 2017-04-19
[PROJECT] MD3 - Material Development for Double exposure and Double patterning
ID: 214948
Start date: 2007-12-01, End date: 2009-11-30
Double patterning lithography has been identified as one of the most promising solutions for the 32nm node patterning. This technique refers to a two step process where a first pattern is exposed, developed and sometimes etched and a second pattern is also exposed, developed ...
Programme: FP7-ICT
Record Number: 85375
Last updated on: 2017-04-13
[PROJECT] MACALO - Magneto Caloritronics
ID: 257159
Start date: 2010-09-01, End date: 2013-08-31
MACALO has two main deliverables, one in software and one in hardware which form the core business of the two European high-tech companies in the consortium. The MACALO consortium consists of pioneers of MAgnetoCALOritronics who cover the complete chain from SME start-up comp...
Programme: FP7-ICT
Record Number: 95513
Last updated on: 2017-04-20
List retrieved on: 2017-08-02
