Community Research and Development Information Service - CORDIS

Horizon 2020 project information and now also report summaries are available on CORDIS. All H2020 projects can be downloaded from the EU Open Data Portal .

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Solid State Quantum Technology and Metrology Using Spins
ID: 267991
Start date: 2011-03-01, End date: 2016-02-29
The development of quantum devices by nanoscopic control of constituents is expected to be one of the largest and most intriguing challenges of modern solid state physics. Among the degrees of freedom which allow exploiting most quantum phenomena are spins. Their long coheren...
Programme: FP7-IDEAS-ERC
Record Number: 98083
Last updated on: 2017-05-26
Nano-scale ICT Devices and Systems Coordination Action
ID: 216165
Start date: 2008-01-01, End date: 2011-12-31
In the semiconductor industry, CMOS technology will certainly continue to have a predominant market position in the future. However, there are still a number of technological challenges, which have to be tackled if CMOS downscaling should be pursued until feature sizes will r...
Programme: FP7-ICT
Record Number: 85323
Last updated on: 2017-04-19
Gigascale Oriented Solid State flAsh Memory for EuRope
ID: 214431
Start date: 2008-01-01, End date: 2011-06-30
The project aims at the development of the technology for very high density Non Volatile Memories for mass storage applications down to the 2X nm technology node. The field is receiving increasing attention, due to the explosion of portable multimedia applications, and is for...
Programme: FP7-ICT
Record Number: 85398
Last updated on: 2017-04-19
Dual-channel CMOS for (sub)-22 nm high performance logic
ID: 214579
Start date: 2007-12-01, End date: 2011-05-31
We propose to develop for the first time a dual-channel CMOS technology comprising high channel mobility (high-µ) Ge pMOS and III-V compound semiconductor nMOS transistors co-integrated on the same complex engineered substrate on Si. This offers a high performance booster as ...
Programme: FP7-ICT
Record Number: 85235
Last updated on: 2017-04-19
European platform for low-power applications on Silicon-on-Insulator Technology
ID: 216373
Start date: 2008-01-01, End date: 2011-06-30
In the framework of FP6, the European Commission supported the formation of a European Network on Silicon on Insulator Technology, Devices and Circuits, whose main goal was to create a discussion forum for the exchange of ideas and results on the topic of Silicon-On-Insulator...
Programme: FP7-ICT
Record Number: 85479
Last updated on: 2017-04-19
Wavelength Division Multiplexed Photonic Layer on CMOS
ID: 216405
Start date: 2008-01-01, End date: 2011-06-30
WADIMOS proposes to develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.These ICs will contain a photonic interconnect layer incorporating microsource arrays and ultracompact WDM (wavelength d...
Programme: FP7-ICT
Record Number: 85248
Last updated on: 2017-04-19
Atomic functionalities on silicon devices
ID: 214989
Start date: 2008-02-01, End date: 2011-07-31
In this project, we wish to take advantage of a fundamental figure-of-merit of the CMOS transistors, the doping modulation, to propose new functionalities arising from the control of a single charge and spin on individual dopants in silicon.
The ultimate electrical switc...
Programme: FP7-ICT
Record Number: 85378
Last updated on: 2017-04-19
Provision of a European training infrastructure
ID: 211806
Start date: 2007-11-01, End date: 2010-10-31
The objective of the EuroTraining proposal is to provide a European Training Infrastructure facilitating the provision of high calibre training across Europe. The structure will support professional advancement training as well as academic training. Professional course provid...
Programme: FP7-ICT
Record Number: 85231
Last updated on: 2017-04-19
Nano Packaging Technology for Interconnect and Heat Dissipation
ID: 216176
Start date: 2007-11-01, End date: 2011-09-30
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integratio...
Programme: FP7-ICT
Record Number: 85245
Last updated on: 2017-04-19
Extended Large (3D) Integration TEchnology
ID: 215030
Start date: 2007-11-01, End date: 2011-08-31
For developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for integration of complex chips is a promisin...
Programme: FP7-ICT
Record Number: 85238
Last updated on: 2017-04-18
12 3 > 
List retrieved on: 2017-11-24
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