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FP6

Final Report - EMCI (A new process for the realisation of Electrical connections between the layers of printed circuit boards and a method to implant micro components using the proposed embedded micro connector injection process)

Project ID: 508172
Funded under: FP6-SME

Abstract

This is the final report of the EMCI project. The major objective of this project was the realisation of the brand new patent pending Embedded micro connector injection (EMCI) process technology, developed by the company ITC Intercircuit, Munich, for the benefit of the printed circuit board manufacturing industry, with a special consideration of environmental and cost cutting factors.

The report provides information regarding the meetings that were held during the project and the main issues that were discussed. Furthermore, the report summarises the work that was performed by the steering committee and provides information regarding the dissemination of knowledge.

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Related information

Record Number: 12408 / Last updated on: 2011-04-14
Category: PROJ