Measurement of the moisture content within TO5 semiconductor packages
Moisture trapped within semiconductor packages can have detrimental effects on the devices' reliability, causing short circuits due to dendritic growth, instability in MOS devices, or open circuit failures due to corrosion. The severity of the attack depends on the amount of moisture available for reaction. This project was set up due to the absence of agreed European standards on acceptable moisture levels in semiconductor packages. It was decided to investigate and validate the measuring procedure before attempting to define a realistic and verifiable level. An intercomparison exercise was proposed, in which the results of measurements of similar samples in several laboratories were compared, and any discrepancies between results investigated, in the moisture concentration range 1700-2000 ppm V. The exercise was limited to measurements taken using equipment based on a mass spectrometer, and did not include measurements by moisture sensors mounted inside the package.
Bibliographic Reference: EUR 13619 EN (1991) 17 pp., MF, ECU 4
Record Number: 199110614 / Last updated on: 1994-12-02
Original language: en
Available languages: en