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The reactive metals Cr and Ti can play a key role in promoting the reliable joining of silicon nitride ceramics. When present in brazes or diffusion bonding interlayers, they can form bridging compounds at the ceramic-metal interfaces. Results are presented for Ag, Cu and Ni brazes and also for Ni diffusion bonding interlayers. The influence of reactive concentration, surface preparation and ceramic source on bond quality is described.

Additional information

Authors: NICHOLAS M G, AEA Technology, Harwell Laboratory, Didcot, Oxon. (GB);PETEVES S D, JRC Petten (NL)
Bibliographic Reference: Paper presented: 6th International Conference on High Technology Joining, Stratford (GB), Sept. 3-5, 1991
Availability: Available from (1) as Paper EN 36286 ORA
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